Taewook Kim

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Kyungki-do, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages with chips partially embedded in adhesive
- Patent number 11,862,603
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Taewook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,646,241
- Issue date May 9, 2023
- Samsung Electronics Co., Ltd.
- Jaehoon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,049,815
- Issue date Jun 29, 2021
- Samsung Electronics Co., Ltd.
- Jooyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Easily-upgradable computer and CPU board therefor
- Patent number 5,678,011
- Issue date Oct 14, 1997
- Samsung Electronics Co., Ltd.
- Taewook Kim
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230268241
- Publication date Aug 24, 2023
- Samsung Electronics Co., Ltd.
- Jaehoon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20210159213
- Publication date May 27, 2021
- Samsung Electronics Co., Ltd.
- Taewook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200273771
- Publication date Aug 27, 2020
- Samsung Electronics Co., Ltd.
- Jaehoon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200144192
- Publication date May 7, 2020
- Samsung Electronics Co., Ltd.
- Jooyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS