Taeyeong Kim

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method and device for displaying notification message
- Patent number 12,175,023
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Taeyeong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Communication method and device using avatar in virtual space
- Patent number 12,086,393
- Issue date Sep 10, 2024
- Samsung Electronics Co., Ltd.
- Youngrog Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device having extendable display and method for providin...
- Patent number 11,922,842
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Myunghoon Kwak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer to wafer bonding apparatus and wafer to wafer bonding method
- Patent number 11,728,197
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Jaehyun Phee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus
- Patent number 11,721,562
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Hyungjun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and method of manufacturing semiconduct...
- Patent number 11,594,443
- Issue date Feb 28, 2023
- Samsung Electronics Co., Ltd.
- Hoechul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and bonding method using the same
- Patent number 10,950,470
- Issue date Mar 16, 2021
- Samsung Electronics Co., Ltd.
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for channel estimation in wireless communicati...
- Patent number 10,931,482
- Issue date Feb 23, 2021
- Samsung Electronics Co., Ltd.
- Jongho Oh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Substrate bonding apparatus
- Patent number 10,923,452
- Issue date Feb 16, 2021
- Samsung Electronics Co., Ltd.
- Ilyoung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for channel estimation in wireless communicati...
- Patent number 10,541,837
- Issue date Jan 21, 2020
- Samsung Electronics Co., Ltd.
- Jongho Oh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Substrate bonding apparatus having adsorption sectors with differen...
- Patent number 10,411,062
- Issue date Sep 10, 2019
- Samsung Electronics Co., Ltd.
- Jun Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through-electrodes and methods for fab...
- Patent number 9,847,276
- Issue date Dec 19, 2017
- Samsung Electronics Co., Ltd.
- Pil-Kyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having stacked structures and methods for fab...
- Patent number 9,653,430
- Issue date May 16, 2017
- Samsung Electronics Co., Ltd.
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer carrier having cavity
- Patent number 9,583,373
- Issue date Feb 28, 2017
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having hybrid stacking structures and methods...
- Patent number 9,530,706
- Issue date Dec 27, 2016
- Samsung Electronics Co., Ltd.
- Pil-Kyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through-vias and methods for fabricati...
- Patent number 9,070,748
- Issue date Jun 30, 2015
- Samsung Electronics Co., Ltd.
- Pil-Kyu Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMMUNICATION METHOD AND DEVICE USING AVATAR IN VIRTUAL SPACE
- Publication number 20240361887
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Youngrog KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEVICE INCLUDING OVERLAY TARGET STRUCTURE
- Publication number 20240153883
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Seunghoon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND COMPUTER-READABLE STORAGE MEDIUM FOR PROVIDIN...
- Publication number 20240062459
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Jonghyuck YOO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR PROVIDING CONVERSATION FUNCTION US...
- Publication number 20240061501
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Wonkyu SUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMMUNICATION METHOD AND DEVICE USING AVATAR IN VIRTUAL SPACE
- Publication number 20240053869
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Youngrog KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230335415
- Publication date Oct 19, 2023
- Samsung Electronics Co., Ltd.
- Hyungjun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR DISPLAYING NOTIFICATION MESSAGE
- Publication number 20230305642
- Publication date Sep 28, 2023
- Samsung Electronics Co., Ltd.
- Taeyeong KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE FOR OUTPUTTING CONTENT, AND ELECTRONIC DEVICE OPE...
- Publication number 20230213978
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- Dahee KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE INCLUDING PLURALITY OF DISPLAYS AND METHOD OF OPE...
- Publication number 20230097982
- Publication date Mar 30, 2023
- Samsung Electronics Co., Ltd.
- Taeyeong KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BONDING ENHANCEMENT LAYER AND METHOD...
- Publication number 20220406740
- Publication date Dec 22, 2022
- Samsung Electronics Co., Ltd.
- Taeyeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING EXTENDABLE DISPLAY AND METHOD FOR PROVIDIN...
- Publication number 20220383786
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- Myunghoon KWAK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER TO WAFER BONDING APPARATUS AND WAFER TO WAFER BONDING METHOD
- Publication number 20220020624
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- Jaehyun PHEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20210143026
- Publication date May 13, 2021
- Samsung Electronics Co., Ltd.
- Hyungjun Jeon
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20210057263
- Publication date Feb 25, 2021
- Samsung Electronics Co., Ltd.
- Hoechul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20210057373
- Publication date Feb 25, 2021
- SAMSUNG ELECTRONICS CO,. LTD.
- TAEYEONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS
- Publication number 20200373274
- Publication date Nov 26, 2020
- Samsung Electronics Co., Ltd.
- Ilyoung HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CHANNEL ESTIMATION IN WIRELESS COMMUNICATI...
- Publication number 20200153662
- Publication date May 14, 2020
- Samsung Electronics Co., Ltd.
- Jongho OH
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SUBSTRATE BONDING APPARATUS AND BONDING METHOD USING THE SAME
- Publication number 20200098599
- Publication date Mar 26, 2020
- Samsung Electronics Co., Ltd.
- TAEYEONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CHANNEL ESTIMATION IN WIRELESS COMMUNICATI...
- Publication number 20180302245
- Publication date Oct 18, 2018
- Samsung Electronics Co., LTD
- Jongho OH
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20180122845
- Publication date May 3, 2018
- Samsung Electronics Co., Ltd.
- Jun Hyung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING HYBRID STACKING STRUCTURES AND METHODS...
- Publication number 20170110445
- Publication date Apr 20, 2017
- PIL-KYU KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING STACKED STRUCTURES AND METHODS FOR FAB...
- Publication number 20160155724
- Publication date Jun 2, 2016
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING HYBRID STACKING STRUCTURES AND METHODS...
- Publication number 20150279825
- Publication date Oct 1, 2015
- Pil-Kyu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH-VIAS AND METHODS FOR FABRICATI...
- Publication number 20150243637
- Publication date Aug 27, 2015
- Pil-Kyu Kang
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH-ELECTRODES AND METHODS FOR FAB...
- Publication number 20150137326
- Publication date May 21, 2015
- Pil-Kyu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH-VIAS AND METHODS FOR FABRICATI...
- Publication number 20140179103
- Publication date Jun 26, 2014
- Pil-Kyu Kang
- G11 - INFORMATION STORAGE
Information Patent Application
Wafer Carrier Having Cavity
- Publication number 20140110894
- Publication date Apr 24, 2014
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS

Taeyeong Kim

Person

Patents Grantslast 30 patents

Method and device for displaying notification message

Communication method and device using avatar in virtual space

Electronic device having extendable display and method for providin...

Wafer to wafer bonding apparatus and wafer to wafer bonding method

Substrate bonding apparatus

Substrate bonding apparatus and method of manufacturing semiconduct...

Substrate bonding apparatus and bonding method using the same

Method and apparatus for channel estimation in wireless communicati...

Substrate bonding apparatus

Method and apparatus for channel estimation in wireless communicati...

Substrate bonding apparatus having adsorption sectors with differen...

Semiconductor devices having through-electrodes and methods for fab...

Semiconductor devices having stacked structures and methods for fab...

Wafer carrier having cavity

Semiconductor devices having hybrid stacking structures and methods...

Semiconductor devices having through-vias and methods for fabricati...

Patents Applicationslast 30 patents

COMMUNICATION METHOD AND DEVICE USING AVATAR IN VIRTUAL SPACE

DEVICE INCLUDING OVERLAY TARGET STRUCTURE

ELECTRONIC DEVICE AND COMPUTER-READABLE STORAGE MEDIUM FOR PROVIDIN...

ELECTRONIC DEVICE AND METHOD FOR PROVIDING CONVERSATION FUNCTION US...

COMMUNICATION METHOD AND DEVICE USING AVATAR IN VIRTUAL SPACE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD AND DEVICE FOR DISPLAYING NOTIFICATION MESSAGE

ELECTRONIC DEVICE FOR OUTPUTTING CONTENT, AND ELECTRONIC DEVICE OPE...

ELECTRONIC DEVICE INCLUDING PLURALITY OF DISPLAYS AND METHOD OF OPE...

SEMICONDUCTOR DEVICE INCLUDING BONDING ENHANCEMENT LAYER AND METHOD...

ELECTRONIC DEVICE HAVING EXTENDABLE DISPLAY AND METHOD FOR PROVIDIN...

WAFER TO WAFER BONDING APPARATUS AND WAFER TO WAFER BONDING METHOD

SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...

SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...

SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...

SUBSTRATE BONDING APPARATUS

METHOD AND APPARATUS FOR CHANNEL ESTIMATION IN WIRELESS COMMUNICATI...

SUBSTRATE BONDING APPARATUS AND BONDING METHOD USING THE SAME

METHOD AND APPARATUS FOR CHANNEL ESTIMATION IN WIRELESS COMMUNICATI...

SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...

SEMICONDUCTOR DEVICES HAVING HYBRID STACKING STRUCTURES AND METHODS...

SEMICONDUCTOR DEVICES HAVING STACKED STRUCTURES AND METHODS FOR FAB...

SEMICONDUCTOR DEVICES HAVING HYBRID STACKING STRUCTURES AND METHODS...

SEMICONDUCTOR DEVICES HAVING THROUGH-VIAS AND METHODS FOR FABRICATI...

SEMICONDUCTOR DEVICES HAVING THROUGH-ELECTRODES AND METHODS FOR FAB...

SEMICONDUCTOR DEVICES HAVING THROUGH-VIAS AND METHODS FOR FABRICATI...

Wafer Carrier Having Cavity