Tai-Chong Chai

Person

Sinapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Electrical connection structure, semiconductor package and method o...
- Patent number 10,755,993
- Issue date Aug 25, 2020
- Agency for Science, Technology and Research
- David Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding stress testing arrangement and method of determining stress
- Patent number 9,506,823
- Issue date Nov 29, 2016
- Agency for Science, Technology and Research
- Cheryl Sharmani Selvanayagam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packages and methods of fabrication
- Patent number 7,189,594
- Issue date Mar 13, 2007
- Agency for Science, Technology and Research
- Vaidyanathan Kripesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for an integrated circuit chip
- Patent number 6,621,151
- Issue date Sep 16, 2003
- Institute of Microelectronics
- Tai Chong Chai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for an integrated circuit chip (integrated circuit perip...
- Patent number 6,583,501
- Issue date Jun 24, 2003
- Institute of Microelectronics
- Tai Chong Chai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for dispensing fluid in an array pattern
- Patent number 5,967,577
- Issue date Oct 19, 1999
- Institute of Microelectronics
- Sarvotham M. Bhandarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for dispensing fluid in an array pattern
- Patent number 5,836,520
- Issue date Nov 17, 1998
- Institute of Microelectronics
- Sarvotham M. Bhandarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing insulated lead frame for integrated circuits
- Patent number 5,229,329
- Issue date Jul 20, 1993
- Texas Instruments, Incorporated
- Tai C. Chai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL CONNECTION STRUCTURE, SEMICONDUCTOR PACKAGE AND METHOD O...
- Publication number 20190080974
- Publication date Mar 14, 2019
- Agency for Science, Technology and Research
- David HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Stress Testing Arrangement and Method of Determining Stress
- Publication number 20130199303
- Publication date Aug 8, 2013
- Agency for Science, Technology and Research
- Cheryl Sharmani Selvanayagam
- G01 - MEASURING TESTING
Information Patent Application
Substrate Arrangement and a Method of Manufacturing a Substrate Arr...
- Publication number 20120126419
- Publication date May 24, 2012
- Vaidyanathan Kripesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level packages and methods of fabrication
- Publication number 20060057832
- Publication date Mar 16, 2006
- Agency for Science, Technology and Research
- Vaidyanathan Kripesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame for an integrated circuit chip (integrated circuit perip...
- Publication number 20020163078
- Publication date Nov 7, 2002
- Tai-Chong Chai
- H01 - BASIC ELECTRIC ELEMENTS

Tai-Chong Chai

Person

Patents Grantslast 30 patents

Electrical connection structure, semiconductor package and method o...

Bonding stress testing arrangement and method of determining stress

Wafer level packages and methods of fabrication

Lead frame for an integrated circuit chip

Lead frame for an integrated circuit chip (integrated circuit perip...

Apparatus for dispensing fluid in an array pattern

Apparatus for dispensing fluid in an array pattern

Method of manufacturing insulated lead frame for integrated circuits

Patents Applicationslast 30 patents

ELECTRICAL CONNECTION STRUCTURE, SEMICONDUCTOR PACKAGE AND METHOD O...

Bonding Stress Testing Arrangement and Method of Determining Stress

Substrate Arrangement and a Method of Manufacturing a Substrate Arr...

Wafer level packages and methods of fabrication

Lead frame for an integrated circuit chip (integrated circuit perip...