Tai-Ming Yang

Person

Tainan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Gate all around device
- Patent number 12,094,946
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit interconnect structures with air gaps
- Patent number 12,062,611
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal line structure and method
- Patent number 12,051,646
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Lun Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and manufacturing method for the same
- Patent number 12,002,709
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal fill with self-aligned patterning and dielectric with v...
- Patent number 11,860,550
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with air-gaps
- Patent number 11,842,962
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lamb wave resonator and method of fabricating the same
- Patent number 11,784,627
- Issue date Oct 10, 2023
- Vanguard International Semiconductor Corporation
- Chin-Yu Chang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor structure including low-resistance interconnect and i...
- Patent number 11,769,695
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,764,106
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for interconnection with self-alignment
- Patent number 11,640,924
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with air-gaps
- Patent number 11,495,539
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stringed instrument resonance analysis device
- Patent number 11,435,224
- Issue date Sep 6, 2022
- Fon Da Tech Co., Ltd.
- Tai-I Yang
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Multi-metal fill with self-aligned patterning and dielectric with v...
- Patent number 11,422,475
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device with self-aligned conductiv...
- Patent number 11,404,367
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetoresistive devices and methods for forming the same
- Patent number 11,366,182
- Issue date Jun 21, 2022
- Vanguard International Semiconductor Corporation
- Chien-Hsun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of gate all around device
- Patent number 11,302,792
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual spacer metal patterning
- Patent number 11,257,673
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Chieh Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit interconnect structures with air gaps
- Patent number 11,244,898
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and formation thereof
- Patent number 11,239,340
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 11,183,422
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nano-electromechanical system (NEMS) device structure and method fo...
- Patent number 11,167,984
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Ping Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interconnect structure and manufacturing method for the same
- Patent number 11,107,725
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal line structure and method
- Patent number 11,101,216
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Lun Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of interconnection structure of semi...
- Patent number 11,088,020
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming fuse pad and bond pad of integrated circuit
- Patent number 11,011,462
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for interconnection with self-alignment
- Patent number 11,004,740
- Issue date May 11, 2021
- TAIWAN SEMICONDCTOR MANUFACTURING CO., LTD.
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 10,991,618
- Issue date Apr 27, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer etching apparatus and method for controlling etch bath of wafer
- Patent number 10,964,559
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating a low-resistance interconnect
- Patent number 10,930,551
- Issue date Feb 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with air-gaps
- Patent number 10,923,424
- Issue date Feb 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH AIR GAPS
- Publication number 20240339406
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...
- Publication number 20240085803
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20230369096
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-Resistance Interconnect
- Publication number 20230369114
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH AIR-GAPS
- Publication number 20220367357
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELF-ALIGNED CONDUCTIVE FEATURES
- Publication number 20220359380
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Metal Fill with Self-Aligned Patterning and Dielectric with V...
- Publication number 20220350262
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMB WAVE RESONATOR AND METHOD OF FABRICATING THE SAME
- Publication number 20220247378
- Publication date Aug 4, 2022
- Vanguard International Semiconductor Corporation
- Chin-Yu Chang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
GATE ALL AROUND DEVICE
- Publication number 20220238676
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Chih WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Interconnect Structures with Air Gaps
- Publication number 20220157720
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20210391211
- Publication date Dec 16, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-WEI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Line Structure and Method
- Publication number 20210375760
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Lun Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Interconnection with Self-Alignment
- Publication number 20210265208
- Publication date Aug 26, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20210242076
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETORESISTIVE DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20210231753
- Publication date Jul 29, 2021
- Vanguard International Semiconductor Corporation
- Chien-Hsun WU
- G01 - MEASURING TESTING
Information Patent Application
Low-Resistance Interconnect
- Publication number 20210175119
- Publication date Jun 10, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH AIR-GAPS
- Publication number 20210159175
- Publication date May 27, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20210066120
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210035853
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRINGED INSTRUMENT RESONANCE ANALYSIS DEVICE
- Publication number 20210018359
- Publication date Jan 21, 2021
- FON DA TECH CO., LTD.
- TAI-I YANG
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20210005510
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-WEI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Fabricating a Low-Resistance Interconnect
- Publication number 20200411374
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF GATE ALL AROUND DEVICE
- Publication number 20200403075
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Chih WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE WITH SELF-ALIGNED CONDUCTIV...
- Publication number 20200343180
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF
- Publication number 20200303516
- Publication date Sep 24, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANO-ELECTROMECHANICAL SYSTEM (NEMS) DEVICE STRUCTURE AND METHOD FO...
- Publication number 20200299129
- Publication date Sep 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Ping CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTERCONNECT STRUCTURE WITH AIR-GAPS
- Publication number 20200294919
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Spacer Metal Patterning
- Publication number 20200168458
- Publication date May 28, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Chieh Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...
- Publication number 20200124985
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Interconnection with Self-Alignment
- Publication number 20200105598
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS

Tai-Ming Yang

Person

Patents Grantslast 30 patents

Gate all around device

Integrated circuit interconnect structures with air gaps

Metal line structure and method

Interconnect structure and manufacturing method for the same

Multi-metal fill with self-aligned patterning and dielectric with v...

Interconnect structure with air-gaps

Lamb wave resonator and method of fabricating the same

Semiconductor structure including low-resistance interconnect and i...

Semiconductor device and method of manufacture

Structure and method for interconnection with self-alignment

Interconnect structure with air-gaps

Stringed instrument resonance analysis device

Multi-metal fill with self-aligned patterning and dielectric with v...

Method for forming semiconductor device with self-aligned conductiv...

Magnetoresistive devices and methods for forming the same

Fabrication of gate all around device

Dual spacer metal patterning

Integrated circuit interconnect structures with air gaps

Semiconductor arrangement and formation thereof

Semiconductor structure and method for manufacturing the same

Nano-electromechanical system (NEMS) device structure and method fo...

Interconnect structure and manufacturing method for the same

Metal line structure and method

Structure and formation method of interconnection structure of semi...

Method for forming fuse pad and bond pad of integrated circuit

Structure and method for interconnection with self-alignment

Semiconductor device and method of manufacture

Wafer etching apparatus and method for controlling etch bath of wafer

Methods for fabricating a low-resistance interconnect

Interconnect structure with air-gaps

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH AIR GAPS

MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

Low-Resistance Interconnect

INTERCONNECT STRUCTURE WITH AIR-GAPS

SEMICONDUCTOR DEVICE WITH SELF-ALIGNED CONDUCTIVE FEATURES

Multi-Metal Fill with Self-Aligned Patterning and Dielectric with V...

LAMB WAVE RESONATOR AND METHOD OF FABRICATING THE SAME

GATE ALL AROUND DEVICE

Integrated Circuit Interconnect Structures with Air Gaps

INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

Metal Line Structure and Method

Structure and Method for Interconnection with Self-Alignment

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

MAGNETORESISTIVE DEVICES AND METHODS FOR FORMING THE SAME

Low-Resistance Interconnect

INTERCONNECT STRUCTURE WITH AIR-GAPS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

STRINGED INSTRUMENT RESONANCE ANALYSIS DEVICE

INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

Methods for Fabricating a Low-Resistance Interconnect

FABRICATION OF GATE ALL AROUND DEVICE

METHOD FOR FORMING SEMICONDUCTOR DEVICE WITH SELF-ALIGNED CONDUCTIV...

SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF

NANO-ELECTROMECHANICAL SYSTEM (NEMS) DEVICE STRUCTURE AND METHOD FO...

INTERCONNECT STRUCTURE WITH AIR-GAPS

Dual Spacer Metal Patterning

MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...

Structure and Method for Interconnection with Self-Alignment