TAI-TSUNG CHANG

Person

TAIPEI, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit, package structure, and manufacturing method of...
- Patent number 12,132,023
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having at least one die with a plurality of taper...
- Patent number 11,990,383
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,848,233
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with enlarged through-vias in encapsulant
- Patent number 11,823,969
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing resist layer, and method of manufacturing semic...
- Patent number 11,789,366
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process including a re-etching process for forming a semiconductor...
- Patent number 11,742,317
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,587,902
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, package structure, and manufacturing method of...
- Patent number 11,515,276
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with enlarged through-vias in encapsulant
- Patent number 11,515,224
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having taper-shaped conductive pillar and method...
- Patent number 11,508,633
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing resist layer, and method of manufacturing semic...
- Patent number 11,378,886
- Issue date Jul 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,289,373
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 10,978,412
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 10,522,501
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Human ARCAP transgenic mouse
- Patent number 10,349,638
- Issue date Jul 16, 2019
- Tai-Jay Chang
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Grant
Urchin-like copper oxide material manufacturing method
- Patent number 8,821,830
- Issue date Sep 2, 2014
- National Chung Cheng University
- Yuan-Yao Li
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Computer system capable of adjusting operating frequency dynamically
- Patent number 8,495,397
- Issue date Jul 23, 2013
- Elitegroup Computer Systems Co., Ltd.
- Ching-Hsiang Yu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Tissue roll holder
- Patent number 7,458,541
- Issue date Dec 2, 2008
- Tai-In Chang
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Grant
Androgen receptor complex-associated protein
- Patent number 7,083,935
- Issue date Aug 1, 2006
- Veterans General Hospital
- Tai-Jay Chang
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Grant
Nucleic acid encoding androgen receptor complex-associated protein
- Patent number 6,974,683
- Issue date Dec 13, 2005
- Veterans General Hospital
- Tai-Jay Chang
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Grant
Container assembly having a cover cap provided with a pump member t...
- Patent number 6,644,489
- Issue date Nov 11, 2003
- Tai-In Chang
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240282653
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230411496
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kan-Ju LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...
- Publication number 20230384684
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PACKAGES WITH ENLARGED THROUGH-VIAS IN ENCAPSULANT
- Publication number 20230369153
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process Including a Re-etching Process for Forming a Semiconductor...
- Publication number 20230352442
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Co., Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURES AND METHODS OF FORMATION
- Publication number 20230137108
- Publication date May 4, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kan-Ju LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF
- Publication number 20230054148
- Publication date Feb 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, PACKAGE STRUCTURE, AND MANUFACTURING METHOD OF...
- Publication number 20230048907
- Publication date Feb 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20230036693
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kan-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER FOR AN INTERCONNECT STRUCTURE
- Publication number 20230008239
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Enlarged Through-Vias in Encapsulant
- Publication number 20220336307
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Co, LTD.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...
- Publication number 20220299880
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220216103
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...
- Publication number 20220100097
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, PACKAGE STRUCTURE, AND MANUFACTURING METHOD OF...
- Publication number 20220068864
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING TAPER-SHAPED CONDUCTIVE PILLAR AND METHOD...
- Publication number 20210375708
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Enlarged Through-Vias in Encapsulant
- Publication number 20210225722
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20210035928
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jui Kuo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor Structure and Method of Forming the Same
- Publication number 20200051949
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200043782
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method of Forming the Same
- Publication number 20200013750
- Publication date Jan 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-step Etching to Form RDL
- Publication number 20190157240
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HUMAN ARCAP TRANSGENIC MOUSE
- Publication number 20190014756
- Publication date Jan 17, 2019
- Tai-Jay Chang
- C07 - ORGANIC CHEMISTRY
Information Patent Application
Urchin-Like Copper Oxide Material Manufacturing Method
- Publication number 20130183228
- Publication date Jul 18, 2013
- Yuan-Yao LI
- B82 - NANO-TECHNOLOGY
Information Patent Application
COMPUTER SYSTEM CAPABLE OF ADJUSTING OPERATING FREQUENCY DYNAMICALLY
- Publication number 20120011377
- Publication date Jan 12, 2012
- Elitegroup Computer Systems Co., Ltd.
- CHING-HSIANG YU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TISSUE ROLL HOLDER
- Publication number 20080308667
- Publication date Dec 18, 2008
- Tai-In Chang
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Application
Androgen receptor complex-associated protein
- Publication number 20050272099
- Publication date Dec 8, 2005
- Veterans General Hospital, a Taiwan corporation
- Tai-Jay Chang
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
Treating breast cancer
- Publication number 20040115656
- Publication date Jun 17, 2004
- Tai-Jay Chang
- C07 - ORGANIC CHEMISTRY
Information Patent Application
CONTAINER ASSEMBLY HAVING A COVER CAP PROVIDED WITH A PUMP MEMBER T...
- Publication number 20030183657
- Publication date Oct 2, 2003
- Tai-In Chang
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Androgen receptor complex-associated protein
- Publication number 20030099976
- Publication date May 29, 2003
- Tai-Jay Chang
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING

TAI-TSUNG CHANG

Person

Patents Grantslast 30 patents

Integrated circuit, package structure, and manufacturing method of...

Package structure having at least one die with a plurality of taper...

Semiconductor package and manufacturing method thereof

Packages with enlarged through-vias in encapsulant

Method for removing resist layer, and method of manufacturing semic...

Process including a re-etching process for forming a semiconductor...

Semiconductor structure and method of forming the same

Integrated circuit, package structure, and manufacturing method of...

Packages with enlarged through-vias in encapsulant

Package structure having taper-shaped conductive pillar and method...

Method for removing resist layer, and method of manufacturing semic...

Semiconductor package and manufacturing method thereof

Manufacturing method of package structure

Semiconductor structure and method of forming the same

Human ARCAP transgenic mouse

Urchin-like copper oxide material manufacturing method

Computer system capable of adjusting operating frequency dynamically

Tissue roll holder

Androgen receptor complex-associated protein

Nucleic acid encoding androgen receptor complex-associated protein

Container assembly having a cover cap provided with a pump member t...

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...

PACKAGES WITH ENLARGED THROUGH-VIAS IN ENCAPSULANT

Process Including a Re-etching Process for Forming a Semiconductor...

SEMICONDUCTOR INTERCONNECT STRUCTURES AND METHODS OF FORMATION

PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF

INTEGRATED CIRCUIT, PACKAGE STRUCTURE, AND MANUFACTURING METHOD OF...

Semiconductor Devices and Methods of Manufacture

BARRIER LAYER FOR AN INTERCONNECT STRUCTURE

Packages with Enlarged Through-Vias in Encapsulant

METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...

INTEGRATED CIRCUIT, PACKAGE STRUCTURE, AND MANUFACTURING METHOD OF...

PACKAGE STRUCTURE HAVING TAPER-SHAPED CONDUCTIVE PILLAR AND METHOD...

Packages with Enlarged Through-Vias in Encapsulant

MANUFACTURING METHOD OF PACKAGE STRUCTURE

Semiconductor Structure and Method of Forming the Same

SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Structure and Method of Forming the Same

Three-step Etching to Form RDL

HUMAN ARCAP TRANSGENIC MOUSE

Urchin-Like Copper Oxide Material Manufacturing Method

COMPUTER SYSTEM CAPABLE OF ADJUSTING OPERATING FREQUENCY DYNAMICALLY

TISSUE ROLL HOLDER

Androgen receptor complex-associated protein

Treating breast cancer

CONTAINER ASSEMBLY HAVING A COVER CAP PROVIDED WITH A PUMP MEMBER T...

Androgen receptor complex-associated protein