Taibo Nakazawa

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device in which a semiconductor chip mounted on a pri...
- Patent number 6,972,488
- Issue date Dec 6, 2005
- NEC Compound Semiconductor Devices, Ltd.
- Taibo Nakazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor circuitry device and method for manufacturing the same
- Patent number 6,429,043
- Issue date Aug 6, 2002
- NEC Corporation
- Taibo Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080296750
- Publication date Dec 4, 2008
- NEC ELECTRONICS CORPORATION
- Taibo NAKAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-component-mounted device and semiconductor device
- Publication number 20050275090
- Publication date Dec 15, 2005
- NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
- Taibo Nakazawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and method of fabricating the same
- Publication number 20030197250
- Publication date Oct 23, 2003
- NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
- Taibo Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-sealed type semiconductor device
- Publication number 20030127732
- Publication date Jul 10, 2003
- Taibo Nakazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin-sealed type semiconductor device
- Publication number 20030127733
- Publication date Jul 10, 2003
- Taibo Nakazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin-sealed type semiconductor device
- Publication number 20030030154
- Publication date Feb 13, 2003
- NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
- Taibo Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS