Taichi Ichikawa

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Gunma-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Backing pad and method for polishing semiconductor wafer therewith
- Patent number 5,788,560
- Issue date Aug 4, 1998
- Shin-Etsu Handotai Co., Ltd.
- Hiromasa Hashimoto
- B24 - GRINDING POLISHING