Taichi Koyama

Person

Shinagawa-ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive and light-emitting device
- Patent number 9,994,743
- Issue date Jun 12, 2018
- DEXERIALS CORPORATION
- Masaharu Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material and method for manufacturing semiconductor devic...
- Patent number 9,957,411
- Issue date May 1, 2018
- Dexerials Corporation
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material and method for manufacturing semiconductor devic...
- Patent number 9,840,645
- Issue date Dec 12, 2017
- Dexerials Corporation
- Taichi Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material and method for manufacturing semiconductor devic...
- Patent number 9,691,677
- Issue date Jun 27, 2017
- Dexerials Corporation
- Taichi Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material and method for manufacturing semiconductor devic...
- Patent number 9,437,462
- Issue date Sep 6, 2016
- Dexerials Corporation
- Taichi Koyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermally conductive adhesive
- Patent number 9,084,373
- Issue date Jul 14, 2015
- Dexerials Corporation
- Taichi Koyama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Epoxy resin composition, method for producing composite unit using...
- Patent number 8,802,776
- Issue date Aug 12, 2014
- Dexerials Corporation
- Taichi Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Underfill Material and Method for Manufacturing Semiconductor Devic...
- Publication number 20160194517
- Publication date Jul 7, 2016
- DEXERIALS CORPORATION
- Takayuki SAITO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE AND LIGHT-EMITTING DEVICE
- Publication number 20160194531
- Publication date Jul 7, 2016
- Dexerials Corporation
- Masaharu AOKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVIC...
- Publication number 20160017191
- Publication date Jan 21, 2016
- DEXERIALS CORPORATION
- Taichi KOYAMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVIC...
- Publication number 20150348858
- Publication date Dec 3, 2015
- DEXERIALS CORPORATION
- Taichi KOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVIC...
- Publication number 20150079736
- Publication date Mar 19, 2015
- DEXERIALS CORPORATION
- Taichi KOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE ADHESIVE
- Publication number 20130279118
- Publication date Oct 24, 2013
- DEXERIALS CORPORATION
- Taichi Koyama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVIC...
- Publication number 20130224913
- Publication date Aug 29, 2013
- DEXERIALS CORPORATION
- Taichi KOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING COMPOSITE UNIT USING...
- Publication number 20120281376
- Publication date Nov 8, 2012
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Taichi Koyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Taichi Koyama

Person

Patents Grantslast 30 patents

Adhesive and light-emitting device

Underfill material and method for manufacturing semiconductor devic...

Underfill material and method for manufacturing semiconductor devic...

Underfill material and method for manufacturing semiconductor devic...

Underfill material and method for manufacturing semiconductor devic...

Thermally conductive adhesive

Epoxy resin composition, method for producing composite unit using...

Patents Applicationslast 30 patents

Underfill Material and Method for Manufacturing Semiconductor Devic...

ADHESIVE AND LIGHT-EMITTING DEVICE

UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVIC...

UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVIC...

UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVIC...

THERMALLY CONDUCTIVE ADHESIVE

UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVIC...

EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING COMPOSITE UNIT USING...