Taihei Nakada

Person

Kawasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having a cap unit with concave portion and me...
- Patent number 9,299,627
- Issue date Mar 29, 2016
- Kabushiki Kaisha Toshiba
- Toshihiko Nagano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 9,041,182
- Issue date May 26, 2015
- Kabushiki Kaisha Toshiba
- Toshihiko Nagano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array antenna apparatus and micro wave transceiver module
- Patent number 8,509,335
- Issue date Aug 13, 2013
- Kabushiki Kaisha Toshiba
- Taihei Nakada
- G01 - MEASURING TESTING
Information Patent Grant
Multilayer high-frequency circuit board
- Patent number 8,164,005
- Issue date Apr 24, 2012
- Kabushiki Kaisha Toshiba
- Yuusuke Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radar apparatus and method for forming reception beam of the same
- Patent number 8,068,052
- Issue date Nov 29, 2011
- Kabushiki Kaisha Toshiba
- Taihei Nakada
- G01 - MEASURING TESTING
Information Patent Grant
High frequency multilayer integrated circuit
- Patent number 7,355,863
- Issue date Apr 8, 2008
- Kabushiki Kaisha Toshiba
- Ryota Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for manufacturing radio frequency board with c...
- Patent number 5,876,789
- Issue date Mar 2, 1999
- Kabushiki Kaisha Toshiba
- Taihei Nakada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
ANTENNA UNIT AND PANEL ARRAY ANTENNA DEVICE
- Publication number 20140285397
- Publication date Sep 25, 2014
- KABUSHIKI KAISHA TOSHIBA
- Shinji TAMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140210066
- Publication date Jul 31, 2014
- KABUSHIKI KAISHA TOSHIBA
- Toshihiko Nagano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130256864
- Publication date Oct 3, 2013
- Toshihiko NAGANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA UNIT AND PANEL ARRAY ANTENNA DEVICE
- Publication number 20120306720
- Publication date Dec 6, 2012
- Kabushiki Kaisha Toshiba
- Shinji TAMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20120228755
- Publication date Sep 13, 2012
- Kabushiki Kaisha Toshiba
- Toshihiko NAGANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY ANTENNA APPARATUS AND MICRO WAVE TRANSCEIVER MODULE
- Publication number 20100265998
- Publication date Oct 21, 2010
- Taihei NAKADA
- G01 - MEASURING TESTING
Information Patent Application
RADAR APPARATUS AND METHOD FOR FORMING RECEPTION BEAM OF THE SAME
- Publication number 20100090897
- Publication date Apr 15, 2010
- Taihei Nakada
- G01 - MEASURING TESTING
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20090231819
- Publication date Sep 17, 2009
- Kabushiki Kaisha Toshiba
- Yoshiaki SATAKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER HIGH-FREQUENCY CIRCUIT BOARD
- Publication number 20080251288
- Publication date Oct 16, 2008
- Yuusuke YAMASHITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High frequency multilayer integrated circuit
- Publication number 20050275078
- Publication date Dec 15, 2005
- Kabushiki Kaisha Toshiba
- Ryota Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Taihei Nakada

Person

Patents Grantslast 30 patents

Semiconductor package having a cap unit with concave portion and me...

Semiconductor package and method of manufacturing the same

Array antenna apparatus and micro wave transceiver module

Multilayer high-frequency circuit board

Radar apparatus and method for forming reception beam of the same

High frequency multilayer integrated circuit

Method and apparatus for manufacturing radio frequency board with c...

Patents Applicationslast 30 patents

ANTENNA UNIT AND PANEL ARRAY ANTENNA DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ANTENNA UNIT AND PANEL ARRAY ANTENNA DEVICE

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

ARRAY ANTENNA APPARATUS AND MICRO WAVE TRANSCEIVER MODULE

RADAR APPARATUS AND METHOD FOR FORMING RECEPTION BEAM OF THE SAME

MULTILAYER SUBSTRATE

MULTILAYER HIGH-FREQUENCY CIRCUIT BOARD

High frequency multilayer integrated circuit