Taisheng Feng

Follow

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer level integrated circuit structure and method of manufacturin...
- Patent number 6,214,630
- Issue date Apr 10, 2001
- United Microelectronics Corp.
- Min-Chih Hsuan
- G01 - MEASURING TESTING