TREA

Taizo KANEZAKI

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer forming method
    • Patent number 12,194,571
    • Issue date Jan 14, 2025
    • Disco Corporation
    • Taizo Kanezaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    SEVERING MACHINE
    • Publication number 20220241900
    • Publication date Aug 4, 2022
    • Disco Corporation
    • Taizo KANEZAKI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER FORMING METHOD
    • Publication number 20210245304
    • Publication date Aug 12, 2021
    • Disco Corporation
    • Taizo KANEZAKI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR