TREA

Tak Sang Yeung

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  • Tin Shui Wai, HK
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Patents Grantslast 30 patents

  • Information Patent Grant

    Flip chip ball grid array package
    • Patent number 7,224,048
    • Issue date May 29, 2007
    • ASAT Ltd.
    • Neil McLellan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Ball grid array package
    • Patent number 6,818,472
    • Issue date Nov 16, 2004
    • ASAT Ltd.
    • Chun Ho Fan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Ball grid array package
    • Patent number 6,800,948
    • Issue date Oct 5, 2004
    • ASAT Ltd.
    • Chun Ho Fan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip scale integrated circuit package
    • Patent number 6,667,191
    • Issue date Dec 23, 2003
    • ASAT Ltd.
    • Neil McLellan
    • H01 - BASIC ELECTRIC ELEMENTS