Tak Shing Pang

Person

Hong Kong, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Camera assembly with embedded components and redistribution layer i...
- Patent number 10,069,018
- Issue date Sep 4, 2018
- Amazon Technologies, Inc.
- Samuel Waising Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imager module with molded packaging
- Patent number 9,848,111
- Issue date Dec 19, 2017
- Amazon Technologies, Inc.
- Tak Shing Pang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multiple camera alignment system with flexible substrates and stiff...
- Patent number 9,838,600
- Issue date Dec 5, 2017
- Amazon Technologies, Inc.
- Samuel Waising Tam
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multiple camera alignment system with rigid substrates
- Patent number 9,838,599
- Issue date Dec 5, 2017
- Amazon Technologies, Inc.
- Samuel Waising Tam
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Imager module with castellated interposer chip
- Patent number 9,706,092
- Issue date Jul 11, 2017
- Amazon Technologies, Inc.
- Samuel Waising Tam
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Imager module with molded packaging
- Patent number 9,681,032
- Issue date Jun 13, 2017
- Amazon Technologies, Inc.
- Samuel Waising Tam
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Solar cell module on molded lead-frame and method of manufacture
- Patent number 9,178,093
- Issue date Nov 3, 2015
- Flextronics AP, LLC
- Samuel Waising Tam
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Camera module with molded tape flip chip imager mount and method of...
- Patent number 8,430,579
- Issue date Apr 30, 2013
- Flextronics AP, LLC
- Samuel Waising Tam
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SOLAR CELL MODULE ON MOLDED LEAD-FRAME AND METHODS OF MANUFACTURE
- Publication number 20130032203
- Publication date Feb 7, 2013
- FLEXTRONICS INTERNATIONAL USA, INC.
- Samuel Waising Tam
- H01 - BASIC ELECTRIC ELEMENTS

Tak Shing Pang

Person

Patents Grantslast 30 patents

Camera assembly with embedded components and redistribution layer i...

Imager module with molded packaging

Multiple camera alignment system with flexible substrates and stiff...

Multiple camera alignment system with rigid substrates

Imager module with castellated interposer chip

Imager module with molded packaging

Solar cell module on molded lead-frame and method of manufacture

Camera module with molded tape flip chip imager mount and method of...

Patents Applicationslast 30 patents

SOLAR CELL MODULE ON MOLDED LEAD-FRAME AND METHODS OF MANUFACTURE