Takaaki INOUE

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer processing method
- Patent number 10,562,207
- Issue date Feb 18, 2020
- Disco Corporation
- Kazuma Sekiya
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Accommodation cassette
- Patent number 9,455,167
- Issue date Sep 27, 2016
- Disco Corporation
- Takaaki Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer processing machine
- Patent number 7,329,079
- Issue date Feb 12, 2008
- Disco Corporation
- Satoshi Ohkawara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Convey device for a plate-like workpiece
- Patent number 6,968,938
- Issue date Nov 29, 2005
- Disco Corporation
- Takaaki Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cutting device
- Patent number 6,861,654
- Issue date Mar 1, 2005
- Disco Corporation
- Takaaki Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chuck table
- Patent number 6,382,609
- Issue date May 7, 2002
- Disco Corporation
- Shinichi Namioka
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS

Patents Applicationslast 30 patents

Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20180229396
- Publication date Aug 16, 2018
- Disco Corporation
- Kazuma Sekiya
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CUTTING APPARATUS
- Publication number 20170341254
- Publication date Nov 30, 2017
- Disco Corporation
- Takaaki Inoue
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
ACCOMMODATION CASSETTE
- Publication number 20150027971
- Publication date Jan 29, 2015
- Disco Corporation
- Takaaki INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCOMMODATION CASSETTE
- Publication number 20130341239
- Publication date Dec 26, 2013
- Takaaki Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer processing machine
- Publication number 20040265100
- Publication date Dec 30, 2004
- Satoshi Ohkawara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Convey device for a plate-like workpiece
- Publication number 20040140176
- Publication date Jul 22, 2004
- Takaaki Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cutting device
- Publication number 20040065851
- Publication date Apr 8, 2004
- Takaaki Inoue
- H01 - BASIC ELECTRIC ELEMENTS