Takaaki Morita

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer board insulating sheet, multilayer board, and method of...
- Patent number 11,546,989
- Issue date Jan 3, 2023
- TDK Corporation
- Seiko Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, multilayer printed wiring board and method fo...
- Patent number 11,445,605
- Issue date Sep 13, 2022
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device-embedded board and method of manufacturing the same
- Patent number 11,412,621
- Issue date Aug 9, 2022
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,382,218
- Issue date Jul 5, 2022
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric component embedded structure
- Patent number 11,335,614
- Issue date May 17, 2022
- TDK Corporation
- Takaaki Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 10,905,013
- Issue date Jan 26, 2021
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Collective mounting method of electronic components and manufacturi...
- Patent number 8,544,167
- Issue date Oct 1, 2013
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board and method for manufacturing the same
- Patent number 8,530,752
- Issue date Sep 10, 2013
- TDK Corporation
- Kenichi Kawabata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component-embedded board and method of manufacturing the...
- Patent number 8,237,059
- Issue date Aug 7, 2012
- TDK Corporation
- Yoshikazu Kanemaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board and method for manufacturing the same
- Patent number 8,188,375
- Issue date May 29, 2012
- TOK Corporation
- Kenichi Kawabata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor IC-embedded substrate and method for manufacturing same
- Patent number 8,026,614
- Issue date Sep 27, 2011
- TDK Corporation
- Kenichi Kawabata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting method of electronic components, manufacturing method of e...
- Patent number 7,906,370
- Issue date Mar 15, 2011
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor IC-embedded substrate and method for manufacturing same
- Patent number 7,544,537
- Issue date Jun 9, 2009
- TDK Corporation
- Kenichi Kawabata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite dielectric, composite dielectric sheet, composite dielect...
- Patent number 7,247,590
- Issue date Jul 24, 2007
- TDK Corporation
- Kenichi Kawabata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
SOLID ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING SOLID ELEC...
- Publication number 20240355554
- Publication date Oct 24, 2024
- TDK Corporation
- Takaaki MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID ELECTROLYTIC CAPACITOR
- Publication number 20240161984
- Publication date May 16, 2024
- TDK Corporation
- Akira EBISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC COMPONENT EMBEDDED STRUCTURE
- Publication number 20210057296
- Publication date Feb 25, 2021
- TDK Corporation
- Takaaki MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD AND METHOD FO...
- Publication number 20210014966
- Publication date Jan 14, 2021
- TDK Corporation
- Takaaki MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE-EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200315034
- Publication date Oct 1, 2020
- TDK Corporation
- Takaaki MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER BOARD INSULATING SHEET, MULTILAYER BOARD, AND METHOD OF...
- Publication number 20200315008
- Publication date Oct 1, 2020
- TDK Corporation
- Seiko KOMATSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190373739
- Publication date Dec 5, 2019
- TDK Corporation
- Takaaki MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190373742
- Publication date Dec 5, 2019
- TDK Corporation
- Takaaki MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Component-Embedded Board and Method of Manufacturing the...
- Publication number 20120285013
- Publication date Nov 15, 2012
- TDK Corporation
- Yoshikazu Kanemaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100083490
- Publication date Apr 8, 2010
- TDK CORPORATION
- Kenichi Kawabata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR IC-EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20090218678
- Publication date Sep 3, 2009
- TDK CORPORATION
- Kenichi Kawabata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component-embedded board and method of manufacturing the...
- Publication number 20090025971
- Publication date Jan 29, 2009
- TDK Corporation
- Yoshikazu Kanemaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Collective mounting method of electronic components and manufacturi...
- Publication number 20080211143
- Publication date Sep 4, 2008
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting method of electronic components, manufacturing method of e...
- Publication number 20080211086
- Publication date Sep 4, 2008
- TDK Corporation
- Takaaki Morita
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor-embedded substrate and manufacturing method thereof
- Publication number 20080079146
- Publication date Apr 3, 2008
- TDK Corporation
- Yasuyuki Hattori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer circuit board and method for manufacturing the same
- Publication number 20070119541
- Publication date May 31, 2007
- TDK CORPORATION
- Kenichi Kawabata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor IC-embedded substrate and method for manufacturing same
- Publication number 20070069363
- Publication date Mar 29, 2007
- TDK CORPORATION
- Kenichi Kawabata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite dielectric, composite dielectric sheet, composite dielect...
- Publication number 20050031849
- Publication date Feb 10, 2005
- TDK Corporation
- Kenichi Kawabata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Takaaki Morita

Person

Patents Grantslast 30 patents

Multilayer board insulating sheet, multilayer board, and method of...

Printed wiring board, multilayer printed wiring board and method fo...

Device-embedded board and method of manufacturing the same

Printed wiring board and method for manufacturing the same

Electric component embedded structure

Printed wiring board and method for manufacturing the same

Collective mounting method of electronic components and manufacturi...

Multilayer circuit board and method for manufacturing the same

Electronic component-embedded board and method of manufacturing the...

Multilayer circuit board and method for manufacturing the same

Semiconductor IC-embedded substrate and method for manufacturing same

Mounting method of electronic components, manufacturing method of e...

Semiconductor IC-embedded substrate and method for manufacturing same

Composite dielectric, composite dielectric sheet, composite dielect...

Patents Applicationslast 30 patents

SOLID ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING SOLID ELEC...

SOLID ELECTROLYTIC CAPACITOR

ELECTRIC COMPONENT EMBEDDED STRUCTURE

PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD AND METHOD FO...

DEVICE-EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME

MULTILAYER BOARD INSULATING SHEET, MULTILAYER BOARD, AND METHOD OF...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Electronic Component-Embedded Board and Method of Manufacturing the...

MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR IC-EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING SAME

Electronic component-embedded board and method of manufacturing the...

Collective mounting method of electronic components and manufacturi...

Mounting method of electronic components, manufacturing method of e...

Semiconductor-embedded substrate and manufacturing method thereof

Multilayer circuit board and method for manufacturing the same

Semiconductor IC-embedded substrate and method for manufacturing same

Composite dielectric, composite dielectric sheet, composite dielect...