TREA

Takafumi Tsujisawa

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  • Toyonaka, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Bump-joining method
    • Patent number 6,572,005
    • Issue date Jun 3, 2003
    • Matsushita Electric Industrial Co., Ltd.
    • Shozo Minamitani
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bump joining judging device and method, and semiconductor component...
    • Patent number 6,439,447
    • Issue date Aug 27, 2002
    • Matsushita Electric Industrial Co., Ltd.
    • Shozo Minamitani
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bump joining method
    • Patent number 6,321,973
    • Issue date Nov 27, 2001
    • Matsushita Electric Industrial Co., Ltd.
    • Shozo Minamitani
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Bump joining method
    • Publication number 20030205607
    • Publication date Nov 6, 2003
    • Shozo Minamitani
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bump joining method
    • Publication number 20020008132
    • Publication date Jan 24, 2002
    • Shozo Minamitani
    • H01 - BASIC ELECTRIC ELEMENTS