Takaharu Hondo

Person

Sakura-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Conductor-layer-equipped structure and touch panel
- Patent number 10,486,398
- Issue date Nov 26, 2019
- Fujikura Ltd.
- Shingo Ogura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring body, wiring board, wiring structure, and touch sensor
- Patent number 10,394,398
- Issue date Aug 27, 2019
- Fujikura Ltd.
- Takaharu Hondo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring body, wiring board, touch sensor and method for producing wi...
- Patent number 10,379,645
- Issue date Aug 13, 2019
- Fujikura Ltd.
- Takaharu Hondo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for producing conductor-layer-provided structure, substrate-...
- Patent number 10,345,936
- Issue date Jul 9, 2019
- Fujikura Ltd.
- Shingo Ogura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring body, wiring board, touch sensor, and method for producing w...
- Patent number 9,910,552
- Issue date Mar 6, 2018
- Fujikura Ltd.
- Takeshi Shiojiri
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring body, wiring board, touch sensor, and method for producing w...
- Patent number 9,880,692
- Issue date Jan 30, 2018
- Fujikura Ltd.
- Takeshi Shiojiri
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method for wiring board
- Patent number 9,232,662
- Issue date Jan 5, 2016
- Fujikura Ltd.
- Takaharu Hondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mold and manufacturing method therefor
- Patent number 8,894,892
- Issue date Nov 25, 2014
- Fujikura Ltd.
- Takaharu Hondo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Laminated wiring board and method for manufacturing the same
- Patent number 8,502,086
- Issue date Aug 6, 2013
- Fujikura Ltd.
- Takaharu Hondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD INCLUDING METAL PIECE AND METHOD FOR MANUFACTURING WIR...
- Publication number 20200404789
- Publication date Dec 24, 2020
- FUJIKURA LTD.
- Takaharu Hondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTOR-LAYER-EQUIPPED STRUCTURE AND TOUCH PANEL
- Publication number 20180154616
- Publication date Jun 7, 2018
- FUJIKURA LTD.
- Shingo Ogura
- B32 - LAYERED PRODUCTS
Information Patent Application
WIRING BODY, WIRING BOARD, TOUCH SENSOR AND METHOD FOR PRODUCING WI...
- Publication number 20170285786
- Publication date Oct 5, 2017
- FUJIKURA LTD.
- Takaharu Hondo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR PRODUCING CONDUCTOR-LAYER-PROVIDED STRUCTURE, SUBSTRATE-...
- Publication number 20170277289
- Publication date Sep 28, 2017
- FUJIKURA LTD.
- Shingo Ogura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING BODY, WIRING BOARD, WIRING STRUCTURE, AND TOUCH SENSOR
- Publication number 20170277306
- Publication date Sep 28, 2017
- FUJIKURA LTD.
- Takaharu Hondo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING BODY, WIRING BOARD, TOUCH SENSOR, AND METHOD FOR PRODUCING W...
- Publication number 20170199600
- Publication date Jul 13, 2017
- FUJIKURA LTD.
- Takeshi Shiojiri
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPONENT-MOUNTING PRINTED BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140168920
- Publication date Jun 19, 2014
- FUJIKURA LTD.
- Takaharu Hondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD AND MANUFACTURING METHOD THEREFOR
- Publication number 20130243970
- Publication date Sep 19, 2013
- FUJIKURA LTD.
- Takaharu HONDO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MANUFACTURING METHOD FOR WIRING BOARD
- Publication number 20130146218
- Publication date Jun 13, 2013
- Takaharu HONDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD FOR SAME
- Publication number 20130025120
- Publication date Jan 31, 2013
- FUJIKURA LTD.
- Takaharu Hondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOLD AND MANUFACTURING METHOD THEREFOR
- Publication number 20120305179
- Publication date Dec 6, 2012
- FUJIKURA LTD.
- Takaharu HONDO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20120216946
- Publication date Aug 30, 2012
- FUJIKURA LTD.
- Takaharu HONDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100147576
- Publication date Jun 17, 2010
- FUJIKURA LTD.
- Takaharu Hondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Takaharu Hondo

Person

Patents Grantslast 30 patents

Conductor-layer-equipped structure and touch panel

Wiring body, wiring board, wiring structure, and touch sensor

Wiring body, wiring board, touch sensor and method for producing wi...

Method for producing conductor-layer-provided structure, substrate-...

Wiring body, wiring board, touch sensor, and method for producing w...

Wiring body, wiring board, touch sensor, and method for producing w...

Manufacturing method for wiring board

Mold and manufacturing method therefor

Laminated wiring board and method for manufacturing the same

Patents Applicationslast 30 patents

WIRING BOARD INCLUDING METAL PIECE AND METHOD FOR MANUFACTURING WIR...

CONDUCTOR-LAYER-EQUIPPED STRUCTURE AND TOUCH PANEL

WIRING BODY, WIRING BOARD, TOUCH SENSOR AND METHOD FOR PRODUCING WI...

METHOD FOR PRODUCING CONDUCTOR-LAYER-PROVIDED STRUCTURE, SUBSTRATE-...

WIRING BODY, WIRING BOARD, WIRING STRUCTURE, AND TOUCH SENSOR

WIRING BODY, WIRING BOARD, TOUCH SENSOR, AND METHOD FOR PRODUCING W...

COMPONENT-MOUNTING PRINTED BOARD AND METHOD OF MANUFACTURING THE SAME

MOLD AND MANUFACTURING METHOD THEREFOR

MANUFACTURING METHOD FOR WIRING BOARD

WIRING BOARD AND MANUFACTURING METHOD FOR SAME

MOLD AND MANUFACTURING METHOD THEREFOR

METHOD OF MANUFACTURING WIRING SUBSTRATE

LAMINATED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME