Takaharu Iwadachi

Person

Nagoya, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonded body comprising beryllium member and copper or copper alloy...
- Patent number 6,824,888
- Issue date Nov 30, 2004
- NGK Insulators, Ltd.
- Toshihisa Hatano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor light-emitting element having first and second epitax...
- Patent number 6,777,720
- Issue date Aug 17, 2004
- NGK Insulators, Ltd.
- Takafumi Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing beryllium-copper alloy hot isostatic press...
- Patent number 6,286,750
- Issue date Sep 11, 2001
- NGK Insulators, Ltd.
- Takaharu Iwadachi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite bonding material of beryllium, copper alloy and stainless...
- Patent number 6,176,418
- Issue date Jan 23, 2001
- NGK Insulators, Ltd.
- Takaharu Iwadachi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
HIP-bonded body and method of producing the same
- Patent number 6,164,524
- Issue date Dec 26, 2000
- NGK Insulators, Ltd.
- Takaharu Iwadachi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production of beryllium-copper alloys and beryllium copper alloys p...
- Patent number 5,354,388
- Issue date Oct 11, 1994
- NGK Insulators, Ltd.
- Keigo Nojiri
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method of hot forming beryllium-copper alloy and hot formed product...
- Patent number 5,131,958
- Issue date Jul 21, 1992
- NGK Insulators, Ltd.
- Taku Sakai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method of producing beryllium copper alloy member
- Patent number 5,074,922
- Issue date Dec 24, 1991
- NGK Insulators, Ltd.
- Hiroyuki Hiramitsu
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Electrically conductive spring materials
- Patent number 4,935,202
- Issue date Jun 19, 1990
- NGK Insulators, Ltd.
- Takaharu Iwadachi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Production of beryllium-copper alloys and alloys produced thereby
- Patent number 4,792,365
- Issue date Dec 20, 1988
- NGK Insulators, Ltd.
- Yosuke Matsui
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Material for lead frames
- Patent number 4,696,704
- Issue date Sep 29, 1987
- NGK Insulators, Ltd.
- Kazumasa Takeuchi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Electroconductive spring material
- Patent number 4,692,192
- Issue date Sep 8, 1987
- NGK Insulators, Ltd.
- Kazuo Ikushima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
Bonded body comprising beryllium member and copper or copper alloy...
- Publication number 20030085260
- Publication date May 8, 2003
- Toshihisa Hatano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor light-emitting element
- Publication number 20020134989
- Publication date Sep 26, 2002
- Takafumi Yao
- H01 - BASIC ELECTRIC ELEMENTS

Takaharu Iwadachi

Person

Patents Grantslast 30 patents

Bonded body comprising beryllium member and copper or copper alloy...

Semiconductor light-emitting element having first and second epitax...

Method of manufacturing beryllium-copper alloy hot isostatic press...

Composite bonding material of beryllium, copper alloy and stainless...

HIP-bonded body and method of producing the same

Production of beryllium-copper alloys and beryllium copper alloys p...

Method of hot forming beryllium-copper alloy and hot formed product...

Method of producing beryllium copper alloy member

Electrically conductive spring materials

Production of beryllium-copper alloys and alloys produced thereby

Material for lead frames

Electroconductive spring material

Patents Applicationslast 30 patents

Bonded body comprising beryllium member and copper or copper alloy...

Semiconductor light-emitting element