Takaharu Miyamoto

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Nagano, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,119,930
- Issue date Feb 21, 2012
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a semiconductor package
- Patent number 7,923,302
- Issue date Apr 12, 2011
- Shinko Electric Industries Co., Ltd.
- Keisuke Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 7,619,316
- Issue date Nov 17, 2009
- Shinko Electric Industries Co., Ltd.
- Keisuke Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial line assembly of a package for a high frequency element
- Patent number 5,557,074
- Issue date Sep 17, 1996
- Fujitsu Limited
- Takaharu Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making a metal wall of a package used for accommodating...
- Patent number 5,277,357
- Issue date Jan 11, 1994
- Shinko Electric Industries Co., Ltd.
- Takaharu Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120096711
- Publication date Apr 26, 2012
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100022054
- Publication date Jan 28, 2010
- SHINKO ELECTRIC INDUSTRIES, CO., LTD.
- Keisuke UEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090126982
- Publication date May 21, 2009
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20090101401
- Publication date Apr 23, 2009
- Shinko Electric Industries Co., Ltd.
- Kazuhiro KOBAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package and method for manufacturing the same
- Publication number 20080128915
- Publication date Jun 5, 2008
- Shinko Electric Industries Co., Ltd.
- Keisuke Ueda
- H01 - BASIC ELECTRIC ELEMENTS