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Takaharu Nagano
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Amagasaki, JP
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last 30 patents
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Patent Grant
Process for removing tin and tin-lead alloy from copper substrates
Patent number
5,035,749
Issue date
Jul 30, 1991
Mec Co., Ltd.
Takashi Haruta
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...