Takahiko Takahashi

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making wiring and logic corrections on a semiconductor de...
- Patent number 6,753,253
- Issue date Jun 22, 2004
- Hitachi, Ltd.
- Takahiko Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC wiring connecting method using focused energy beams
- Patent number 5,824,598
- Issue date Oct 20, 1998
- Hitachi, Ltd.
- Hiroshi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method and apparatus using focused energy beam
- Patent number 5,683,547
- Issue date Nov 4, 1997
- Hitachi, Ltd.
- Junzou Azuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC wiring connecting method and apparatus
- Patent number 5,497,034
- Issue date Mar 5, 1996
- Hitachi, Ltd.
- Hiroshi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC wiring connecting method and apparatus
- Patent number 5,472,507
- Issue date Dec 5, 1995
- Hitachi, Ltd.
- Hiroshi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for modifying wiring of semiconductor device
- Patent number 5,182,231
- Issue date Jan 26, 1993
- Hitachi, Ltd.
- Mikio Hongo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of etching a semiconductor device by an ion beam
- Patent number 5,086,015
- Issue date Feb 4, 1992
- Hitachi, Ltd.
- Fumikazu Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered device micro etching method and system
- Patent number 5,055,696
- Issue date Oct 8, 1991
- Hitachi, Ltd.
- Satoshi Haraichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring method of on-chip modification for an LSI
- Patent number 5,043,297
- Issue date Aug 27, 1991
- Hitachi, Ltd.
- Katsuyoshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of providing a semiconductor IC device with an additional co...
- Patent number 5,026,664
- Issue date Jun 25, 1991
- Hitachi, Ltd.
- Mikio Hongo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and process for producing t...
- Patent number 4,900,695
- Issue date Feb 13, 1990
- Hitachi, Ltd.
- Takahiko Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC wiring connecting method and resulting article
- Patent number 4,868,068
- Issue date Sep 19, 1989
- Hitachi, Ltd.
- Hiroshi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor integrated circuit devices
- Patent number 4,469,535
- Issue date Sep 4, 1984
- Hitachi, Ltd.
- Shigeo Kuroda
- H01 - BASIC ELECTRIC ELEMENTS

Takahiko Takahashi

Person

Patents Grantslast 30 patents

Method of making wiring and logic corrections on a semiconductor de...

IC wiring connecting method using focused energy beams

Processing method and apparatus using focused energy beam

IC wiring connecting method and apparatus

IC wiring connecting method and apparatus

Method for modifying wiring of semiconductor device

Method of etching a semiconductor device by an ion beam

Multilayered device micro etching method and system

Wiring method of on-chip modification for an LSI

Method of providing a semiconductor IC device with an additional co...

Semiconductor integrated circuit device and process for producing t...

IC wiring connecting method and resulting article

Method of fabricating semiconductor integrated circuit devices