Takahiko Wada

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Shinagawa-ku, JP

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Patents Grantslast 30 patents

Information Patent Grant
Inspection of ball grid array soldering with boundary detection usi...
- Patent number 9,084,386
- Issue date Jul 14, 2015
- Saki Corporation
- Takahiko Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INSPECTION APPARATUS
- Publication number 20120294508
- Publication date Nov 22, 2012
- Takahiko Wada
- G06 - COMPUTING CALCULATING COUNTING