Takahiro AKASHI

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Hyogo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip-encapsulating resin composition containing epoxy...
- Patent number 11,244,878
- Issue date Feb 8, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kyoko Nishidono
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EPOXY RESIN COMPOSITION AND RESIN-ENCAPSULATED SUBSTRATE
- Publication number 20210292473
- Publication date Sep 23, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Takahiro AKASHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR-CHIP-ENCAPSULATING RESIN COMPOSITION AND SEMICONDUCTO...
- Publication number 20210183719
- Publication date Jun 17, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Kyoko NISHIDONO
- H01 - BASIC ELECTRIC ELEMENTS