Takahiro Daikoku

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Heat-resistant imaging camera that moves in a high temperature furnace
- Patent number 11,172,103
- Issue date Nov 9, 2021
- Hitachi Kokusai Electric Inc.
- Keigo Nakamura
- G01 - MEASURING TESTING
Information Patent Grant
Railway equipment inspecting and measuring apparatus, and railway e...
- Patent number 11,044,838
- Issue date Jun 22, 2021
- Hitachi High-Tech Fine Systems Corporation
- Hideyasu Suzuki
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Liquid-cooling cold plate and method for manufacturing same
- Patent number 10,532,401
- Issue date Jan 14, 2020
- Hitachi Kokusai Electric Inc.
- Satoru Ujiie
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sheet supplying apparatus and printing apparatus
- Patent number 10,421,299
- Issue date Sep 24, 2019
- Canon Kabushiki Kaisha
- Takahiro Daikoku
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Sealing structure for multi-chip module
- Patent number 7,518,233
- Issue date Apr 14, 2009
- Hitachi, Ltd.
- Kouichi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for sealing and cooling multi-chip modules
- Patent number 6,890,799
- Issue date May 10, 2005
- Hitachi, Ltd.
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling apparatus for electronic unit
- Patent number 6,711,017
- Issue date Mar 23, 2004
- Hitachi Kokusai Electric Inc.
- Tateki Kurokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Highly thermal conductive grease composition and cooling device usi...
- Patent number 6,632,780
- Issue date Oct 14, 2003
- Hitachi, Ltd.
- Takao Uematsu
- C10 - PETROLEUM, GAS OR COKE INDUSTRIES TECHNICAL GASES CONTAINING CARBON MON...
Information Patent Grant
Device for sealing and cooling multi-chip modules
- Patent number 6,528,878
- Issue date Mar 4, 2003
- Hitachi, Ltd.
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for cooling multi-chip modules
- Patent number 6,351,384
- Issue date Feb 26, 2002
- Hitachi, Ltd.
- Takahiro Daikoku
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Multi-chip module
- Patent number 6,281,575
- Issue date Aug 28, 2001
- Hitachi, Ltd.
- Toru Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air-cooled electronic apparatus with condensation prevention
- Patent number 5,934,368
- Issue date Aug 10, 1999
- Hitachi, Ltd.
- Tetsuya Tanaka
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Cooling apparatus for electronic devices
- Patent number 5,818,694
- Issue date Oct 6, 1998
- Hitachi, Ltd.
- Takahiro Daikoku
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Low thermal resistant, fluid-cooled semiconductor module
- Patent number 5,774,334
- Issue date Jun 30, 1998
- Hitachi, Ltd.
- Keizo Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device of multi-chip module
- Patent number 5,751,062
- Issue date May 12, 1998
- Hitachi, Ltd.
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device of semiconductor chips
- Patent number RE35721
- Issue date Feb 3, 1998
- Hitachi, Ltd.
- Takahiro Daikoku
- 165 - Heat exchange
Information Patent Grant
Semiconductor module
- Patent number 5,705,850
- Issue date Jan 6, 1998
- Hitachi, Ltd.
- Noriyuki Ashiwake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling apparatus for electronic device
- Patent number 5,705,854
- Issue date Jan 6, 1998
- Hitachi, Ltd.
- Takayuki Atarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of actively controlling noise, and apparatus thereof
- Patent number 5,689,572
- Issue date Nov 18, 1997
- Hitachi, Ltd.
- Katsuo Ohki
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Cooling apparatus of electronic devices
- Patent number 5,595,240
- Issue date Jan 21, 1997
- Hitachi, Ltd.
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 5,592,363
- Issue date Jan 7, 1997
- Hitachi, Ltd.
- Takayuki Atarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forced air cooling apparatus having blower and air current regulati...
- Patent number 5,558,493
- Issue date Sep 24, 1996
- Hitachi, Ltd.
- Yutaka Hayashi
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Cooling apparatus of electronic devices
- Patent number 5,515,912
- Issue date May 14, 1996
- Hitachi, Ltd.
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling apparatus for electronic equipment
- Patent number 5,504,651
- Issue date Apr 2, 1996
- Hitachi Chemical Co., Ltd.
- Takayuki Atarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sinks and semiconductor cooling device using the heat sinks
- Patent number 5,365,400
- Issue date Nov 15, 1994
- Hitachi, Ltd.
- Noriyuki Ashiwake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for cooling heat generating members
- Patent number 5,349,831
- Issue date Sep 27, 1994
- Hitachi, Ltd.
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling apparatus for electronic device
- Patent number 5,345,107
- Issue date Sep 6, 1994
- Hitachi, Ltd.
- Takahiro Daikoku
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Bonding structure of thermal conductive members for a multi-chip mo...
- Patent number 5,276,586
- Issue date Jan 4, 1994
- Hitachi, Ltd.
- Toshio Hatsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid impingement cooling module for semiconductor devices
- Patent number 5,270,572
- Issue date Dec 14, 1993
- Hitachi, Ltd.
- Tadakatsu Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling arrangement for semiconductor devices and method of making...
- Patent number 5,133,403
- Issue date Jul 28, 1992
- Hitachi, Ltd.
- Hitoshi Yokono
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
PRINTING APPARATUS AND CONTROL METHOD OF PRINTING APPARATUS
- Publication number 20240198696
- Publication date Jun 20, 2024
- Canon Kabushiki Kaisha
- SHUHEI TADA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CARRIAGE APPARATUS, PRINTING APPARATUS, AND CONTROL METHOD THEREOF
- Publication number 20220097427
- Publication date Mar 31, 2022
- Canon Kabushiki Kaisha
- Tomohito Abe
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
HEAT-RESISTANT IMAGING CAMERA THAT MOVES IN A HIGH TEMPERATURE FURNACE
- Publication number 20210075938
- Publication date Mar 11, 2021
- Hitachi Kokusai Electric Inc.
- Keigo NAKAMURA
- G01 - MEASURING TESTING
Information Patent Application
RAILWAY EQUIPMENT INSPECTING AND MEASURING APPARATUS, AND RAILWAY E...
- Publication number 20190297750
- Publication date Sep 26, 2019
- HITACHI HIGH-TECH FINE SYSTEMS CORPORATION
- Hideyasu SUZUKI
- B60 - VEHICLES IN GENERAL
Information Patent Application
SHEET SUPPLYING APPARATUS AND PRINTING APPARATUS
- Publication number 20180257407
- Publication date Sep 13, 2018
- Canon Kabushiki Kaisha
- Takahiro Daikoku
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIQUID-COOLING COLD PLATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20180078997
- Publication date Mar 22, 2018
- Hitachi Kokusai Electric Inc.
- Satoru UJIIE
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Device for sealing and cooling multi-chip modules
- Publication number 20030103333
- Publication date Jun 5, 2003
- Hitachi, Ltd
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling apparatus for electronic unit
- Publication number 20030016498
- Publication date Jan 23, 2003
- Tateki Kurokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Takahiro Daikoku

Person

Patents Grantslast 30 patents

Heat-resistant imaging camera that moves in a high temperature furnace

Railway equipment inspecting and measuring apparatus, and railway e...

Liquid-cooling cold plate and method for manufacturing same

Sheet supplying apparatus and printing apparatus

Sealing structure for multi-chip module

Device for sealing and cooling multi-chip modules

Cooling apparatus for electronic unit

Highly thermal conductive grease composition and cooling device usi...

Device for sealing and cooling multi-chip modules

Device and method for cooling multi-chip modules

Multi-chip module

Air-cooled electronic apparatus with condensation prevention

Cooling apparatus for electronic devices

Low thermal resistant, fluid-cooled semiconductor module

Cooling device of multi-chip module

Cooling device of semiconductor chips

Semiconductor module

Cooling apparatus for electronic device

Method of actively controlling noise, and apparatus thereof

Cooling apparatus of electronic devices

Electronic apparatus

Forced air cooling apparatus having blower and air current regulati...

Cooling apparatus of electronic devices

Cooling apparatus for electronic equipment

Heat sinks and semiconductor cooling device using the heat sinks

Apparatus for cooling heat generating members

Cooling apparatus for electronic device

Bonding structure of thermal conductive members for a multi-chip mo...

Liquid impingement cooling module for semiconductor devices

Cooling arrangement for semiconductor devices and method of making...

Patents Applicationslast 30 patents

PRINTING APPARATUS AND CONTROL METHOD OF PRINTING APPARATUS

CARRIAGE APPARATUS, PRINTING APPARATUS, AND CONTROL METHOD THEREOF

HEAT-RESISTANT IMAGING CAMERA THAT MOVES IN A HIGH TEMPERATURE FURNACE

RAILWAY EQUIPMENT INSPECTING AND MEASURING APPARATUS, AND RAILWAY E...

SHEET SUPPLYING APPARATUS AND PRINTING APPARATUS

LIQUID-COOLING COLD PLATE AND METHOD FOR MANUFACTURING SAME

Device for sealing and cooling multi-chip modules

Cooling apparatus for electronic unit