Takahiro Hattori

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming bump electrode substrate
- Patent number 11,478,869
- Issue date Oct 25, 2022
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder ball, chip solder, solder paste and solder joint
- Patent number 11,465,244
- Issue date Oct 11, 2022
- Senju Metal Industry Co., Ltd.
- Ken Tachibana
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder ball, chip solder, solder paste, and solder joint
- Patent number 10,773,345
- Issue date Sep 15, 2020
- Senju Metal Industry Co., Ltd.
- Ken Tachibana
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material, solder paste, solder preform, solder joint and met...
- Patent number 10,717,157
- Issue date Jul 21, 2020
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Flux composition for solder applications
- Patent number 10,610,979
- Issue date Apr 7, 2020
- Senju Metal Industry Co., Ltd.
- Daisuke Maruko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Core material, semiconductor package, and forming method of bump el...
- Patent number 10,381,319
- Issue date Aug 13, 2019
- Senju Metal Industry Co., Ltd.
- Tomoaki Nishino
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Cu core ball, solder paste, formed solder, Cu core column, and sold...
- Patent number 10,322,472
- Issue date Jun 18, 2019
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Cu ball
- Patent number 9,668,358
- Issue date May 30, 2017
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump electrode, board which has bump electrodes, and method for man...
- Patent number 9,662,730
- Issue date May 30, 2017
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
D/A converter
- Patent number 5,977,900
- Issue date Nov 2, 1999
- NEC Corporation
- Takahiro Hattori
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Operational amplifier circuit
- Patent number 5,705,952
- Issue date Jan 6, 1998
- NEC Corporation
- Takahiro Hattori
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING BUMP ELECTRODE SUBSTRATE
- Publication number 20210387276
- Publication date Dec 16, 2021
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro HATTORI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MATERIAL, SOLDER PASTE, FORMED SOLDER AND SOLDER JOINT
- Publication number 20200061757
- Publication date Feb 27, 2020
- SENJU METAL INDUSTRY CO., LTD.
- Tomoaki NISHINO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Solder Alloy, Solder Ball, Chip Solder, Solder Paste, and Solder Joint
- Publication number 20190070696
- Publication date Mar 7, 2019
- SENJU METAL INDUSTRY CO., LTD.
- Ken TACHIBANA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flux
- Publication number 20180339375
- Publication date Nov 29, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Daisuke Maruko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Core Material, Semiconductor Package, and Forming Method of Bump El...
- Publication number 20180174991
- Publication date Jun 21, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Tomoaki Nishino
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Solder Material, Solder Paste, Solder Preform, Solder Joint and Met...
- Publication number 20170312860
- Publication date Nov 2, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Hattori
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Solder Alloy, Solder Ball, Chip Solder, Solder Paste and Solder Joint
- Publication number 20170216975
- Publication date Aug 3, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Ken TACHIBANA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu Core Ball, Solder Paste, Formed Solder, Cu Core Column, and Sold...
- Publication number 20160368105
- Publication date Dec 22, 2016
- SENJU METAL INDUSTRY CO., LTD
- Takahiro Hattori
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu BALL
- Publication number 20150336216
- Publication date Nov 26, 2015
- Senju Metal lndustry Co., Ltd.
- Takahiro HATTORI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu BALL
- Publication number 20150313025
- Publication date Oct 29, 2015
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi KAWASAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Bump Electrode, Board Which Has Bump Electrodes, and Method for Man...
- Publication number 20150061129
- Publication date Mar 5, 2015
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Hattori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Switch device and overcurrent controlling method
- Publication number 20020015272
- Publication date Feb 7, 2002
- NEC Corporation
- Takahiro Hattori
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Takahiro Hattori

Person

Patents Grantslast 30 patents

Method for forming bump electrode substrate

Solder alloy, solder ball, chip solder, solder paste and solder joint

Solder alloy, solder ball, chip solder, solder paste, and solder joint

Solder material, solder paste, solder preform, solder joint and met...

Flux composition for solder applications

Core material, semiconductor package, and forming method of bump el...

Cu core ball, solder paste, formed solder, Cu core column, and sold...

Cu ball

Bump electrode, board which has bump electrodes, and method for man...

D/A converter

Operational amplifier circuit

Patents Applicationslast 30 patents

METHOD FOR FORMING BUMP ELECTRODE SUBSTRATE

SOLDER MATERIAL, SOLDER PASTE, FORMED SOLDER AND SOLDER JOINT

Solder Alloy, Solder Ball, Chip Solder, Solder Paste, and Solder Joint

Flux

Core Material, Semiconductor Package, and Forming Method of Bump El...

Solder Material, Solder Paste, Solder Preform, Solder Joint and Met...

Solder Alloy, Solder Ball, Chip Solder, Solder Paste and Solder Joint

Cu Core Ball, Solder Paste, Formed Solder, Cu Core Column, and Sold...

Cu BALL

Cu BALL

Bump Electrode, Board Which Has Bump Electrodes, and Method for Man...

Switch device and overcurrent controlling method