Takahiro Horie

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Shimodate, JP

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Patents Grantslast 30 patents

Information Patent Grant
Epoxy resin composition for semiconductor sealing and resin molded...
- Patent number 6,005,030
- Issue date Dec 21, 1999
- Hitachi Chemical Company, Ltd.
- Mitsuo Togawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...