Takahiro HORIKOSHI

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Chofu-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 9,299,620
- Issue date Mar 29, 2016
- Nikon Corporation
- Takahiro Horikoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for semiconductor device, method for manufacturing semicondu...
- Patent number 8,856,722
- Issue date Oct 7, 2014
- Nikon Corporation
- Isao Sugaya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 8,454,771
- Issue date Jun 4, 2013
- Nikon Corporation
- Takahiro Horikoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for semiconductor device, method for manufacturing semicondu...
- Patent number 8,370,789
- Issue date Feb 5, 2013
- Nikon Corporation
- Isao Sugaya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Exposure method, exposure apparatus and making method of the appara...
- Patent number 6,813,004
- Issue date Nov 2, 2004
- Nikon Corporation
- Takahiro Horikoshi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
DESIGN SYSTEM FOR SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SE...
- Publication number 20140304674
- Publication date Oct 9, 2014
- Isao SUGAYA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DESIGN SYSTEM FOR SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SE...
- Publication number 20140181781
- Publication date Jun 26, 2014
- Isao SUGAYA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20130244350
- Publication date Sep 19, 2013
- Nikon Corporation
- Takahiro HORIKOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN SYSTEM FOR SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SE...
- Publication number 20130191806
- Publication date Jul 25, 2013
- Nikon Corporation
- Isao Sugaya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DESIGN SYSTEM FOR SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SE...
- Publication number 20110202890
- Publication date Aug 18, 2011
- Isao SUGAYA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Substrate Bonding Apparatus and Substrate Bonding Method
- Publication number 20100139836
- Publication date Jun 10, 2010
- Takahiro HORIKOSHI
- H01 - BASIC ELECTRIC ELEMENTS