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Takahiro Imai
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Shiga, JP
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Patents Grants
last 30 patents
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Patent Grant
Production method and device of surface roughened copper plate, and...
Patent number
9,758,890
Issue date
Sep 12, 2017
Furukawa Electric Co., Ltd.
Hajime Watanabe
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method for producing a surface roughened copper plate
Patent number
8,815,072
Issue date
Aug 26, 2014
Furukawa Electric Co., Ltd.
Hajime Watanabe
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Patents Applications
last 30 patents
Information
Patent Application
PRODUCTION METHOD AND DEVICE OF SURFACE ROUGHENED COPPER PLATE, AND...
Publication number
20140339094
Publication date
Nov 20, 2014
Hajime WATANABE
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PRODUCTION METHOD AND DEVICE OF SURFACE ROUGHENED COPPER PLATE, AND...
Publication number
20100304176
Publication date
Dec 2, 2010
Hajime Watanabe
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR