Takahiro Kida

Person

Kosyoku-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for processing semiconductor wafer, method for manufacturing...
- Patent number 9,905,411
- Issue date Feb 27, 2018
- Shin-Etsu Handotai Co., Ltd.
- Yuki Miyazawa
- B24 - GRINDING POLISHING
Information Patent Grant
Double-side polishing apparatus
- Patent number 9,108,289
- Issue date Aug 18, 2015
- Shin-Etsu Handotai Co., Ltd.
- Daisuke Furukawa
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing method and double-side polishing apparatus
- Patent number 8,834,230
- Issue date Sep 16, 2014
- Shin-Etsu Handotai Co., Ltd.
- Daisuke Furukawa
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer manufacturing method and wafer
- Patent number 7,250,368
- Issue date Jul 31, 2007
- Shin-Etsu Handotai Co., Ltd.
- Takahiro Kida
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing method and wafer polishing device
- Patent number 6,764,392
- Issue date Jul 20, 2004
- Shin-Etsu Handotai Co., Ltd.
- Takashi Nihonmatsu
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing a work and an apparatus for polishing a work
- Patent number 6,558,227
- Issue date May 6, 2003
- Shin-Etsu Handotai Co., Ltd.
- Masao Kodaira
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing thin plate and plate for holding thin plate
- Patent number 6,217,417
- Issue date Apr 17, 2001
- Shin-Etsu Handotai Co., Ltd.
- Mikio Nakamura
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PROCESSING SEMICONDUCTOR WAFER, METHOD FOR MANUFACTURING...
- Publication number 20170301533
- Publication date Oct 19, 2017
- Shin-Etsu Handotai Co., Ltd.
- Yuki MIYAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDE POLISHING APPARATUS
- Publication number 20150031271
- Publication date Jan 29, 2015
- Shin-Etsu Handotai Co., Ltd.
- Daisuke FURUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER POLISHING METHOD AND DOUBLE-SIDE POLISHING APPARATUS
- Publication number 20110130073
- Publication date Jun 2, 2011
- Shin-Etsu Handotai Co., Ltd.
- Daisuke Furukawa
- B24 - GRINDING POLISHING
Information Patent Application
Method for Producing Polishing Agent, Polishing Agent Produced Ther...
- Publication number 20080125016
- Publication date May 29, 2008
- Shin-Etsu Handotai Co., Ltd.
- Mikio Nakamura
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor water manufacturing method and wafer
- Publication number 20050142882
- Publication date Jun 30, 2005
- Takahiro Kida
- B24 - GRINDING POLISHING
Information Patent Application
Wafer polishing method and wafer polishing device
- Publication number 20020160693
- Publication date Oct 31, 2002
- Takashi Nihonmatsu
- B24 - GRINDING POLISHING

Takahiro Kida

Person

Patents Grantslast 30 patents

Method for processing semiconductor wafer, method for manufacturing...

Double-side polishing apparatus

Wafer polishing method and double-side polishing apparatus

Semiconductor wafer manufacturing method and wafer

Wafer polishing method and wafer polishing device

Method for polishing a work and an apparatus for polishing a work

Method for polishing thin plate and plate for holding thin plate

Patents Applicationslast 30 patents

METHOD FOR PROCESSING SEMICONDUCTOR WAFER, METHOD FOR MANUFACTURING...

DOUBLE-SIDE POLISHING APPARATUS

WAFER POLISHING METHOD AND DOUBLE-SIDE POLISHING APPARATUS

Method for Producing Polishing Agent, Polishing Agent Produced Ther...

Semiconductor water manufacturing method and wafer

Wafer polishing method and wafer polishing device