Takahiro MINATOYA

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Pressure-sensitive adhesive sheet-including wiring circuit board an...
- Patent number 12,144,125
- Issue date Nov 12, 2024
- Nitto Denko Corporation
- Takahiro Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRODUCING METHOD OF WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD S...
- Publication number 20210195757
- Publication date Jun 24, 2021
- Nitto Denko Corporation
- Takahiro MINATOYA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PRESSURE-SENSITIVE ADHESIVE SHEET-INCLUDING WIRING CIRCUIT BOARD AN...
- Publication number 20210127499
- Publication date Apr 29, 2021
- Nitto Denko Corporation
- Takahiro TAKANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR