Takahiro Nanjo

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus and control method
- Patent number 11,260,493
- Issue date Mar 1, 2022
- Ebara Corporation
- Minoru Harada
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate transfer apparatus and substrate transfer method
- Patent number 10,354,900
- Issue date Jul 16, 2019
- Ebara Corporation
- Akihiro Yazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate plating apparatus
- Patent number 7,208,074
- Issue date Apr 24, 2007
- Ebara Corporation
- Koji Mishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate plating apparatus
- Patent number 6,689,257
- Issue date Feb 10, 2004
- Ebara Corporation
- Koji Mishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning apparatus
- Patent number 6,092,542
- Issue date Jul 25, 2000
- Ebara Corporation
- Naoki Matsuda
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND CONTROL METHOD
- Publication number 20190217438
- Publication date Jul 18, 2019
- EBARA CORPORATION
- Minoru Harada
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE TRANSFER APPARATUS AND SUBSTRATE TRANSFER METHOD
- Publication number 20170178940
- Publication date Jun 22, 2017
- EBARA CORPORATION
- Akihiro Yazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate processing apparatus and substrate plating apparatus
- Publication number 20060027452
- Publication date Feb 9, 2006
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate processing apparatus and substrate plating apparatus
- Publication number 20040134789
- Publication date Jul 15, 2004
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate processing apparatus and substrate plating apparatus
- Publication number 20020000371
- Publication date Jan 3, 2002
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR