Takahiro Oka

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming silicon-containing dielectric film by cyclic dep...
- Patent number 8,722,546
- Issue date May 13, 2014
- ASM IP Holding B.V.
- Atsuki Fukazawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor chip package
- Patent number 7,211,883
- Issue date May 1, 2007
- Oki Electric Industry Co., Ltd.
- Takahiro Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package
- Patent number 7,075,177
- Issue date Jul 11, 2006
- Oki Electric Industry Co., Ltd.
- Takahiro Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating same
- Patent number 7,067,357
- Issue date Jun 27, 2006
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for fabricating semiconductor apparatus using board frame
- Patent number 6,948,239
- Issue date Sep 27, 2005
- Oki Electric Industry Co., Ltd.
- Takahiro Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating same
- Patent number 6,831,354
- Issue date Dec 14, 2004
- Oki Electric Industry Co, Ltd.
- Makoto Terui
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of manufacturing a semiconductor device having a die pad wit...
- Patent number 6,777,264
- Issue date Aug 17, 2004
- Oki Electric Industry Co., Ltd.
- Takahiro Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 6,551,906
- Issue date Apr 22, 2003
- Oki Electric Industry Co., Ltd.
- Takahiro Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board frame, method for fabricating thereof and method for fabricat...
- Patent number 6,512,287
- Issue date Jan 28, 2003
- Oki Electric Industry Co., Ltd.
- Takahiro Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,472,729
- Issue date Oct 29, 2002
- Oki Electric Industry Co., Ltd.
- Takahiro Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing resin encapsulated semiconductor device
- Patent number 6,174,751
- Issue date Jan 16, 2001
- Oki Electric Industry Co., Ltd.
- Takahiro Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact resin-sealed semiconductor device
- Patent number 6,084,300
- Issue date Jul 4, 2000
- Oki Electric Industry Co., Ltd.
- Takahiro Oka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Forming Silicon-Containing Dielectric Film by Cyclic Dep...
- Publication number 20130330933
- Publication date Dec 12, 2013
- ASM IP HOLDING B.V.
- Atsuki Fukazawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor chip package
- Publication number 20050212108
- Publication date Sep 29, 2005
- Oki Electric Industry Co., Ltd.
- Takahiro Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method of fabricating same
- Publication number 20040183175
- Publication date Sep 23, 2004
- Oki Electric Industry Co., Ltd.
- Makoto Terui
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Board frame, method for fabricating thereof and method for fabricat...
- Publication number 20030082855
- Publication date May 1, 2003
- Takahiro Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method of fabricating same
- Publication number 20030030133
- Publication date Feb 13, 2003
- Makoto Terui
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of manufacturing a semiconductor device having a die pad wit...
- Publication number 20030020177
- Publication date Jan 30, 2003
- Takahiro Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package
- Publication number 20020105067
- Publication date Aug 8, 2002
- Takahiro Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating semiconductor device
- Publication number 20020048904
- Publication date Apr 25, 2002
- Takahiro Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and the method for manufacturing the same
- Publication number 20010023994
- Publication date Sep 27, 2001
- Takahiro Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND PACKAGE STRUCTURE FOR T...
- Publication number 20010011768
- Publication date Aug 9, 2001
- YOUICHI KOHARA
- H01 - BASIC ELECTRIC ELEMENTS

Takahiro Oka

Person

Patents Grantslast 30 patents

Method for forming silicon-containing dielectric film by cyclic dep...

Semiconductor chip package

Semiconductor chip package

Semiconductor package and method of fabricating same

Method for fabricating semiconductor apparatus using board frame

Semiconductor package and method of fabricating same

Method of manufacturing a semiconductor device having a die pad wit...

Method of fabricating semiconductor device

Board frame, method for fabricating thereof and method for fabricat...

Semiconductor device

Method of manufacturing resin encapsulated semiconductor device

Compact resin-sealed semiconductor device

Patents Applicationslast 30 patents

Method for Forming Silicon-Containing Dielectric Film by Cyclic Dep...

Semiconductor chip package

Semiconductor package and method of fabricating same

Board frame, method for fabricating thereof and method for fabricat...

Semiconductor package and method of fabricating same

Method of manufacturing a semiconductor device having a die pad wit...

Semiconductor chip package

Method of fabricating semiconductor device

Semiconductor device and the method for manufacturing the same

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND PACKAGE STRUCTURE FOR T...