Takahiro Saito

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of cutting CSP substrates
- Patent number 6,901,924
- Issue date Jun 7, 2005
- Disco Corporation
- Takahiro Saito
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTROLYTIC COPPER FOIL, AND CIRCUIT BOARD AND FLEXIBLE CIRCUIT BO...
- Publication number 20140342178
- Publication date Nov 20, 2014
- FURUKAWA ELECTRIC CO., LTD.
- Takahiro Saito
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INSULATOR, MOTOR AND METHOD FOR MANUFACTURING STATOR INCLUDING INSU...
- Publication number 20130113332
- Publication date May 9, 2013
- Takahiro Saito
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PROTECTION MODULE AND METHOD FOR MANAGING STATUS DATA OF THE PROTEC...
- Publication number 20120206107
- Publication date Aug 16, 2012
- MITSUMI ELECTRIC CO., LTD.
- Kimitoshi ONO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE
- Publication number 20110171491
- Publication date Jul 14, 2011
- FURUKAWA ELECTRIC CO., LTD.
- Yuji Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC COPPER COATING, METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20110139626
- Publication date Jun 16, 2011
- FURUKAWA ELECTRIC CO., LTD.
- Takahiro Saito
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of cutting CSP substrates
- Publication number 20010007253
- Publication date Jul 12, 2001
- Takahiro Saito
- H01 - BASIC ELECTRIC ELEMENTS

Takahiro Saito

Person

Patents Grantslast 30 patents

Method of cutting CSP substrates

Patents Applicationslast 30 patents

ELECTROLYTIC COPPER FOIL, AND CIRCUIT BOARD AND FLEXIBLE CIRCUIT BO...

INSULATOR, MOTOR AND METHOD FOR MANUFACTURING STATOR INCLUDING INSU...

PROTECTION MODULE AND METHOD FOR MANAGING STATUS DATA OF THE PROTEC...

ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE

ELECTROLYTIC COPPER COATING, METHOD OF MANUFACTURING THE SAME, AND...

Method of cutting CSP substrates