Takahiro Setaka

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Kawasaki-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding method and bonding apparatus
- Patent number 9,962,915
- Issue date May 8, 2018
- Tokyo Ohka Kogyo Co., Ltd.
- Atsushi Miyanari
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING METHOD AND BONDING APPARATUS
- Publication number 20140374017
- Publication date Dec 25, 2014
- Atsushi Miyanari
- B32 - LAYERED PRODUCTS