Takahiro TOMIMATSU

Person

Yokkaichi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,057,422
- Issue date Aug 6, 2024
- Kioxia Corporation
- Takahiro Tomimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,688,726
- Issue date Jun 27, 2023
- Kioxia Corporation
- Yasunori Iwashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,562,976
- Issue date Jan 24, 2023
- Kioxia Corporation
- Takahiro Tomimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,063,062
- Issue date Jul 13, 2021
- TOSHIBA MEMORY CORPORATION
- Jun Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer wiring structure, method for manufacturing multi-layer...
- Patent number 10,586,804
- Issue date Mar 10, 2020
- TOSHIBA MEMORY CORPORATION
- Takahiro Tomimatsu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 10,483,124
- Issue date Nov 19, 2019
- TOSHIBA MEMORY CORPORATION
- Masakazu Sawano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230129339
- Publication date Apr 27, 2023
- KIOXIA Corporation
- Takahiro TOMIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230017218
- Publication date Jan 19, 2023
- KIOXIA Corporation
- Yasuhiro UCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220084970
- Publication date Mar 17, 2022
- KIOXIA Corporation
- Takahiro TOMIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220085003
- Publication date Mar 17, 2022
- KIOXIA Corporation
- Yasunori IWASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200295037
- Publication date Sep 17, 2020
- Toshiba Memory Corporation
- Jun Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20200286990
- Publication date Sep 10, 2020
- Toshiba Memory Corporation
- Yasuhiro UCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200091173
- Publication date Mar 19, 2020
- Toshiba Memory Corporation
- Osamu MIYAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190214268
- Publication date Jul 11, 2019
- Toshiba Memory Corporation
- Masakazu SAWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER WIRING STRUCTURE, METHOD FOR MANUFACTURING MULTI-LAYER...
- Publication number 20190088672
- Publication date Mar 21, 2019
- Toshiba Memory Corporation
- Takahiro TOMIMATSU
- G11 - INFORMATION STORAGE

Takahiro TOMIMATSU

Person

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Multi-layer wiring structure, method for manufacturing multi-layer...

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

MULTI-LAYER WIRING STRUCTURE, METHOD FOR MANUFACTURING MULTI-LAYER...