Takahiro YAMADA

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Ogaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate
- Patent number 12,232,257
- Issue date Feb 18, 2025
- Ibiden Co., Ltd.
- Shunsuke Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in wiring substrate
- Patent number 11,792,937
- Issue date Oct 17, 2023
- Ibiden Co., Ltd.
- Takahiro Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE
- Publication number 20220192018
- Publication date Jun 16, 2022
- IBIDEN CO., LTD.
- Shunsuke SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT BUILT-IN WIRING SUBSTRATE
- Publication number 20220087024
- Publication date Mar 17, 2022
- IBIDEN CO., LTD.
- Takahiro YAMADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR