Takahiro Yonezawa

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component mounting apparatus and electronic component mo...
- Patent number 7,246,430
- Issue date Jul 24, 2007
- Matsushita Electric Industrial Co., Ltd.
- Takahiro Yonezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element having protruded bump electrodes
- Patent number 7,071,090
- Issue date Jul 4, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding method apparatus
- Patent number 6,902,101
- Issue date Jun 7, 2005
- Matsushita Electric Industrial Co., Ltd.
- Satoshi Horie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element having protruded bump electrodes
- Patent number 6,894,387
- Issue date May 17, 2005
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method and apparatus
- Patent number 6,712,111
- Issue date Mar 30, 2004
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Tokunaga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bare chip mounting method and bare chip mounting system
- Patent number 6,680,221
- Issue date Jan 20, 2004
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Tokunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film substrate treatment apparatus, film substrate treatment method...
- Patent number 6,667,250
- Issue date Dec 23, 2003
- Matsushita Electric Industrial Co., Ltd.
- Tatsuo Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Working method for holding a work object by suction
- Patent number 6,619,535
- Issue date Sep 16, 2003
- Matsushita Electric Industrial Co., Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding device and bump bonding method
- Patent number 6,481,616
- Issue date Nov 19, 2002
- Matsushita Electric Industrial Co. Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 6,474,538
- Issue date Nov 5, 2002
- Matsushita Electric Industrial Co., Ltd.
- Takahiro Yonezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for packaging IC chip, and tape-shaped carrier...
- Patent number 6,332,268
- Issue date Dec 25, 2001
- Matsushita Electric Industrial Co., Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding device and bump bonding method
- Patent number 6,328,196
- Issue date Dec 11, 2001
- Matsushita Electric Industrial Co., Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a ball bond using a bonding capillary
- Patent number 6,207,549
- Issue date Mar 27, 2001
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding method and bump bonding apparatus
- Patent number 6,017,812
- Issue date Jan 25, 2000
- Matsushita Electric Industrial Co., Ltd.
- Takahiro Yonezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump levelling method and bump levelling apparatus
- Patent number 5,899,140
- Issue date May 4, 1999
- Matsushita Electric Industrial Co., Ltd.
- Akihiro Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonder with a discard bonding area
- Patent number 5,899,375
- Issue date May 4, 1999
- Matsushita Electric Industrial Co., Ltd.
- Koichi Yoshida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 5,686,353
- Issue date Nov 11, 1997
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiko Yagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic wire bonding apparatus and method
- Patent number 5,667,130
- Issue date Sep 16, 1997
- Matsushita Electric Industrial Co., Ltd.
- Makoto Morita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting apparatus of electronic component
- Patent number 5,457,874
- Issue date Oct 17, 1995
- Matsushita Electric Industrial Co., Ltd.
- Takahiro Yonezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for mounting electronic component on substrate
- Patent number 5,339,248
- Issue date Aug 16, 1994
- Matsushita Electric Industrial Co., Ltd.
- Muneyoshi Fujiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor element having protruded bump electrodes
- Publication number 20050146029
- Publication date Jul 7, 2005
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component mounting apparatus and electronic component mo...
- Publication number 20050071991
- Publication date Apr 7, 2005
- Takahiro Yonezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Film substrate treatment apparatus, film substrate treatment method...
- Publication number 20030183339
- Publication date Oct 2, 2003
- Matsushita Elec. Ind. Co. Ltd.
- Tatsuo Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bump bonding method and apparatue
- Publication number 20030094481
- Publication date May 22, 2003
- Matsushita Electric Industrial Co., Ltd.
- Satoshi Horie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bare chip mounting method and bare chip mounting system
- Publication number 20030096451
- Publication date May 22, 2003
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Tokunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding method and apparatus
- Publication number 20020125303
- Publication date Sep 12, 2002
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Tokunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump bonding device and bump bonding method
- Publication number 20020030087
- Publication date Mar 14, 2002
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a ball bond using a bonding capillary
- Publication number 20010005054
- Publication date Jun 28, 2001
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS

Takahiro Yonezawa

Person

Patents Grantslast 30 patents

Electronic component mounting apparatus and electronic component mo...

Semiconductor element having protruded bump electrodes

Bump bonding method apparatus

Semiconductor element having protruded bump electrodes

Bonding method and apparatus

Bare chip mounting method and bare chip mounting system

Film substrate treatment apparatus, film substrate treatment method...

Working method for holding a work object by suction

Bump bonding device and bump bonding method

Bonding apparatus and bonding method

Method and apparatus for packaging IC chip, and tape-shaped carrier...

Bump bonding device and bump bonding method

Method of forming a ball bond using a bonding capillary

Bump bonding method and bump bonding apparatus

Bump levelling method and bump levelling apparatus

Bump bonder with a discard bonding area

Semiconductor device and manufacturing method thereof

Ultrasonic wire bonding apparatus and method

Mounting apparatus of electronic component

Apparatus for mounting electronic component on substrate

Patents Applicationslast 30 patents

Semiconductor element having protruded bump electrodes

Electronic component mounting apparatus and electronic component mo...

Film substrate treatment apparatus, film substrate treatment method...

Bump bonding method and apparatue

Bare chip mounting method and bare chip mounting system

Bonding method and apparatus

Bump bonding device and bump bonding method

Method of forming a ball bond using a bonding capillary