Takahisa Okuzono

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Device for measuring bump height, apparatus for processing substrat...
- Patent number 11,604,150
- Issue date Mar 14, 2023
- Ebara Corporation
- Takahisa Okuzono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for processing a substrate
- Patent number 11,371,155
- Issue date Jun 28, 2022
- Ebara Corporation
- Takahisa Okuzono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Device for inspecting a bump height surrounded by resist, device fo...
- Patent number 10,910,334
- Issue date Feb 2, 2021
- Ebara Corporation
- Takahisa Okuzono
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for processing a substrate
- Patent number 10,508,352
- Issue date Dec 17, 2019
- Ebara Corporation
- Takahisa Okuzono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
DEVICE FOR MEASURING BUMP HEIGHT, APPARATUS FOR PROCESSING SUBSTRAT...
- Publication number 20210285893
- Publication date Sep 16, 2021
- EBARA CORPORATION
- Takahisa Okuzono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20200080218
- Publication date Mar 12, 2020
- EBARA CORPORATION
- Takahisa Okuzono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEVICE FOR INSPECTING A BUMP HEIGHT, DEVICE FOR PROCESSING A SUBSTR...
- Publication number 20190348384
- Publication date Nov 14, 2019
- EBARA CORPORATION
- Takahisa OKUZONO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20180179656
- Publication date Jun 28, 2018
- EBARA CORPORATION
- Takahisa Okuzono
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR