Takahito Nakazawa

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a protection pattern with two element s...
- Patent number 8,241,999
- Issue date Aug 14, 2012
- Kabushiki Kaisha Toshiba
- Takafumi Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip pickup device and method of manufacturing semiconductor device
- Patent number 6,774,011
- Issue date Aug 10, 2004
- Kabushiki Kaisha Toshiba
- Takahito Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 6,448,665
- Issue date Sep 10, 2002
- Kabushiki Kaisha Toshiba
- Takahito Nakazawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing a semiconductor package
- Patent number 6,379,484
- Issue date Apr 30, 2002
- Kabushiki Kaisha Toshiba
- Takahito Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing a semiconductor package
- Patent number 6,191,024
- Issue date Feb 20, 2001
- Kabushiki Kaisha Toshiba
- Takahito Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip semiconductor package
- Patent number 6,011,312
- Issue date Jan 4, 2000
- Kabushiki Kaisha Toshiba
- Takahito Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and apparatus for res...
- Patent number 5,998,243
- Issue date Dec 7, 1999
- Kabushiki Kaisha Toshiba
- Teikou Odashima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus and method for manufacturing a semiconductor package
- Patent number 5,935,375
- Issue date Aug 10, 1999
- Kabushiki Kaisha Toshiba
- Takahito Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 5,677,246
- Issue date Oct 14, 1997
- Kabushiki Kaisha Toshiba
- Hideaki Maeta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100237438
- Publication date Sep 23, 2010
- Kabushiki Kaisha Toshiba
- Takafumi IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip pickup device and method of manufacturing semiconductor device
- Publication number 20020019074
- Publication date Feb 14, 2002
- Kabushiki Kaisha Toshiba
- Takahito Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and manufacturing method thereof
- Publication number 20010020736
- Publication date Sep 13, 2001
- Kabushiki Kaisha Toshiba
- Takahito Nakazawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Apparatus and method for manufacturing a semiconductor package
- Publication number 20010000754
- Publication date May 3, 2001
- Kabushiki Kaisha Toshiba
- Takahito Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS

Takahito Nakazawa

Person

Patents Grantslast 30 patents

Semiconductor device having a protection pattern with two element s...

Chip pickup device and method of manufacturing semiconductor device

Semiconductor package and manufacturing method thereof

Method for manufacturing a semiconductor package

Apparatus and method for manufacturing a semiconductor package

Flip-chip semiconductor package

Method for manufacturing semiconductor device and apparatus for res...

Apparatus and method for manufacturing a semiconductor package

Method of manufacturing semiconductor devices

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

Chip pickup device and method of manufacturing semiconductor device

Semiconductor package and manufacturing method thereof

Apparatus and method for manufacturing a semiconductor package