Takahito Watanabe

Person

Yamato-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 12,142,603
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side pad anchored by next adjacent via
- Patent number 11,735,529
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Takahito Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 11,735,575
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Restoring a wearable biological sensor
- Patent number 11,660,026
- Issue date May 30, 2023
- International Business Machines Corporation
- Keiji Matsumoto
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Large capacity solid state battery
- Patent number 11,637,325
- Issue date Apr 25, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating an interconnection using a sacrificial layer
- Patent number 11,574,817
- Issue date Feb 7, 2023
- International Business Machines Corporation
- Takahito Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of bridging between solder joints
- Patent number 11,456,269
- Issue date Sep 27, 2022
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection with side connection to substrate
- Patent number 11,264,314
- Issue date Mar 1, 2022
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large capacity solid state battery
- Patent number 11,211,638
- Issue date Dec 28, 2021
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of bridging between solder joints
- Patent number 11,004,819
- Issue date May 11, 2021
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a plurality of magnetic shields
- Patent number 9,324,663
- Issue date Apr 26, 2016
- Renesas Electronics Corporation
- Takahito Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,172,028
- Issue date Oct 27, 2015
- Renesas Electronics Corporation
- Takahito Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 8,749,033
- Issue date Jun 10, 2014
- Renesas Electronics Corporation
- Takahito Watanabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS
- Publication number 20250006681
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECT STRUCTURE
- Publication number 20240006371
- Publication date Jan 4, 2024
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP INTERCONNECT PACKAGE
- Publication number 20230307307
- Publication date Sep 28, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP INTERCONNECT PACKAGE FINE JET UNDERFILL
- Publication number 20230307372
- Publication date Sep 28, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20230299067
- Publication date Sep 21, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE CAPACITY SOLID STATE BATTERY
- Publication number 20230170532
- Publication date Jun 1, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20220384412
- Publication date Dec 1, 2022
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDE PAD ANCHORED BY NEXT ADJACENT VIA
- Publication number 20220375867
- Publication date Nov 24, 2022
- International Business Machines Corporation
- Takahito Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING AN INTERCONNECTION USING A SACRIFICIAL LAYER
- Publication number 20220359227
- Publication date Nov 10, 2022
- International Business Machines Corporation
- Takahito Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS
- Publication number 20210210454
- Publication date Jul 8, 2021
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESTORING A WEARABLE BIOLOGICAL SENSOR
- Publication number 20210145325
- Publication date May 20, 2021
- International Business Machines Corporation
- Keiji Matsumoto
- G01 - MEASURING TESTING
Information Patent Application
INTERCONNECTION WITH SIDE CONNECTION TO SUBSTRATE
- Publication number 20210098349
- Publication date Apr 1, 2021
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS
- Publication number 20210098404
- Publication date Apr 1, 2021
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE CAPACITY SOLID STATE BATTERY
- Publication number 20190051943
- Publication date Feb 14, 2019
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE CAPACITY SOLID STATE BATTERY
- Publication number 20190051944
- Publication date Feb 14, 2019
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140239425
- Publication date Aug 28, 2014
- RENESAS ELECTRONICS CORPORATION
- TAKAHITO WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130256819
- Publication date Oct 3, 2013
- Takahito WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device And Method Of Manufacturing Semiconductor Device
- Publication number 20120119338
- Publication date May 17, 2012
- RENESAS ELECTRONICS CORPORATION
- Takahito Watanabe
- H01 - BASIC ELECTRIC ELEMENTS

Takahito Watanabe

Person

Patents Grantslast 30 patents

Bonding of bridge to multiple semiconductor chips

Side pad anchored by next adjacent via

Bonding of bridge to multiple semiconductor chips

Restoring a wearable biological sensor

Large capacity solid state battery

Fabricating an interconnection using a sacrificial layer

Prevention of bridging between solder joints

Interconnection with side connection to substrate

Large capacity solid state battery

Prevention of bridging between solder joints

Semiconductor device including a plurality of magnetic shields

Semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Patents Applicationslast 30 patents

UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS

SEMICONDUCTOR DEVICE INTERCONNECT STRUCTURE

MULTICHIP INTERCONNECT PACKAGE

MULTICHIP INTERCONNECT PACKAGE FINE JET UNDERFILL

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

LARGE CAPACITY SOLID STATE BATTERY

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

SIDE PAD ANCHORED BY NEXT ADJACENT VIA

FABRICATING AN INTERCONNECTION USING A SACRIFICIAL LAYER

PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS

RESTORING A WEARABLE BIOLOGICAL SENSOR

INTERCONNECTION WITH SIDE CONNECTION TO SUBSTRATE

PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS

LARGE CAPACITY SOLID STATE BATTERY

LARGE CAPACITY SOLID STATE BATTERY

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Semiconductor Device And Method Of Manufacturing Semiconductor Device