Takaji Takenaka

Person

Hatano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Structure for mounting a semiconductor device and a capacitor devic...
- Patent number 6,272,020
- Issue date Aug 7, 2001
- Hitachi, Ltd.
- Hiromi Tosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for diagnosing the life of a solder connection
- Patent number 5,291,419
- Issue date Mar 1, 1994
- Hitachi, Ltd.
- Ryohei Satoh
- G01 - MEASURING TESTING
Information Patent Grant
Methods of recovering a multi-layer printed circuit board
- Patent number 5,257,452
- Issue date Nov 2, 1993
- Hitachi, Ltd.
- Tsutomu Imai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit device provided with a ceramic substrate having...
- Patent number 5,249,100
- Issue date Sep 28, 1993
- Hitachi, Ltd.
- Ryohei Satoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit device, method of connecting with solder and sol...
- Patent number 5,136,360
- Issue date Aug 4, 1992
- Hitachi, Ltd.
- Masahide Harada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip module structure
- Patent number 4,930,002
- Issue date May 29, 1990
- Hitachi, Ltd.
- Takaji Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for airtightly packaging semiconductor package
- Patent number 4,836,434
- Issue date Jun 6, 1989
- Hitachi, Ltd.
- Takaji Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 4,725,925
- Issue date Feb 16, 1988
- Hitachi, Ltd.
- Minoru Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit board
- Patent number 4,706,165
- Issue date Nov 10, 1987
- Hitachi Microcomputer Engineering Co., Ltd.
- Takaji Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer apparatus
- Patent number 4,619,316
- Issue date Oct 28, 1986
- Hitachi, Ltd.
- Wataru Nakayama
- F28 - HEAT EXCHANGE IN GENERAL

Takaji Takenaka

Person

Patents Grantslast 30 patents

Structure for mounting a semiconductor device and a capacitor devic...

Method for diagnosing the life of a solder connection

Methods of recovering a multi-layer printed circuit board

Electronic circuit device provided with a ceramic substrate having...

Electronic circuit device, method of connecting with solder and sol...

Multi-chip module structure

Method and apparatus for airtightly packaging semiconductor package

Circuit board

Multilayer circuit board

Heat transfer apparatus