Takamasa Nakai

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Process for the production of copper-clad laminate
- Patent number 5,435,877
- Issue date Jul 25, 1995
- Mitsubishi Gas Chemical Company, Inc.
- Kenji Ishii
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Metal foil-clad laminate having surface smoothness
- Patent number 5,368,921
- Issue date Nov 29, 1994
- Mitsubishi Gas Chemical Company, Inc.
- Kenji Ishii
- B32 - LAYERED PRODUCTS
Information Patent Grant
Process for producing thin copper foil-clad circuit board substrate
- Patent number 5,242,540
- Issue date Sep 7, 1993
- Mitsubishi Gas Chemical Co., Inc.
- Kenji Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical laminate having ability to absorb ultraviolet rays
- Patent number 5,160,787
- Issue date Nov 3, 1992
- Mitsubishi Gas Chemical Company, Inc.
- Morio Gaku
- B32 - LAYERED PRODUCTS