Takamasa ODA

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Fukuoka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including resin case having groove at corner t...
- Patent number 11,876,033
- Issue date Jan 16, 2024
- Mitsubishi Electric Corporation
- Takuro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having metal wire bonded to plural metal block...
- Patent number 11,257,760
- Issue date Feb 22, 2022
- Mitsubishi Electric Corporation
- Seiji Saiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,593,605
- Issue date Mar 17, 2020
- Mitsubishi Electric Corporation
- Yoshitaka Otsubo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND INVERTER DEVICE
- Publication number 20230010169
- Publication date Jan 12, 2023
- Mitsubishi Electric Corporation
- Yosuke Miyagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210183736
- Publication date Jun 17, 2021
- Mitsubishi Electric Corporation
- Takuro MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210143094
- Publication date May 13, 2021
- Mitsubishi Electric Corporation
- Seiji SAIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190304859
- Publication date Oct 3, 2019
- Mitsubishi Electric Corporation
- Yoshitaka OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS