Takamasa TAKANO

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 12,136,591
- Issue date Nov 5, 2024
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and mounting substrate
- Patent number 12,119,293
- Issue date Oct 15, 2024
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer line structure and method for manufacturing thereof
- Patent number 11,862,564
- Issue date Jan 2, 2024
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate, method of manufacturing through electr...
- Patent number 11,810,820
- Issue date Nov 7, 2023
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 11,742,273
- Issue date Aug 29, 2023
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 11,430,730
- Issue date Aug 30, 2022
- Dai Nippon Printing Co., Ltd.
- Yuki Aritsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate, method of manufacturing through electr...
- Patent number 11,373,906
- Issue date Jun 28, 2022
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Line structure and a method for producing the same
- Patent number 11,217,530
- Issue date Jan 4, 2022
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate, manufacturing method thereof and mount...
- Patent number 11,195,768
- Issue date Dec 7, 2021
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Line structure and a method for producing the same
- Patent number 11,069,618
- Issue date Jul 20, 2021
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate, method of manufacturing through electr...
- Patent number 10,957,592
- Issue date Mar 23, 2021
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 10,950,533
- Issue date Mar 16, 2021
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection element
- Patent number 10,712,453
- Issue date Jul 14, 2020
- Dai Nippon Printing Co., Ltd.
- Kohei Ota
- G01 - MEASURING TESTING
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,600,728
- Issue date Mar 24, 2020
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Line structure and a method for producing the same
- Patent number 10,586,768
- Issue date Mar 10, 2020
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Line structure and a method for producing the same
- Patent number 10,121,748
- Issue date Nov 6, 2018
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,014,244
- Issue date Jul 3, 2018
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Line structure and a method for producing the same
- Patent number 9,735,108
- Issue date Aug 15, 2017
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor device and manufacturing method thereof
- Patent number 9,476,898
- Issue date Oct 25, 2016
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Through-hole electrode substrate
- Patent number 9,443,788
- Issue date Sep 13, 2016
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor device and manufacturing method thereof
- Patent number 9,347,967
- Issue date May 24, 2016
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor device manufacturing method and sensor device
- Patent number 9,209,319
- Issue date Dec 8, 2015
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Through-hole electrode substrate and method of manufacturing the same
- Patent number 8,623,751
- Issue date Jan 7, 2014
- Dai Nippon Printing Co., Ltd.
- Koichi Nakayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a through-hole electrode substrate
- Patent number 8,544,169
- Issue date Oct 1, 2013
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate and method of manufacturing the same
- Patent number 8,198,726
- Issue date Jun 12, 2012
- Dai Nippon Printing Co., Ltd.
- Koichi Nakayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR PACKAG...
- Publication number 20240096808
- Publication date Mar 21, 2024
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20240088040
- Publication date Mar 14, 2024
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20230282557
- Publication date Sep 7, 2023
- DAI NIPPON PRINTING CO., LTD.
- Takamasa TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE, METHOD OF MANUFACTURING THROUGH ELECTR...
- Publication number 20220328353
- Publication date Oct 13, 2022
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE, MANUFACTURING METHOD THEREOF AND MOUNT...
- Publication number 20220059422
- Publication date Feb 24, 2022
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi KUDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE
- Publication number 20220028772
- Publication date Jan 27, 2022
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER LINE STRUCTURE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20210313277
- Publication date Oct 7, 2021
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE, METHOD OF MANUFACTURING THROUGH ELECTR...
- Publication number 20210175121
- Publication date Jun 10, 2021
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20210159153
- Publication date May 27, 2021
- DAI NIPPON PRINTING CO., LTD.
- Takamasa TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20210134717
- Publication date May 6, 2021
- DAI NIPPON PRINTING CO., LTD.
- Yuki ARITSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE, MANUFACTURING METHOD THEREOF AND MOUNT...
- Publication number 20210035874
- Publication date Feb 4, 2021
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi KUDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINE STRUCTURE AND A METHOD FOR PRODUCING THE SAME
- Publication number 20200144196
- Publication date May 7, 2020
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LINE STRUCTURE AND A METHOD FOR PRODUCING THE SAME
- Publication number 20200144197
- Publication date May 7, 2020
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20190304888
- Publication date Oct 3, 2019
- DAI NIPPON PRINTING CO., LTD.
- Takamasa TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE, METHOD OF MANUFACTURING THROUGH ELECTR...
- Publication number 20190287853
- Publication date Sep 19, 2019
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE
- Publication number 20190259696
- Publication date Aug 22, 2019
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINE STRUCTURE AND A METHOD FOR PRODUCING THE SAME
- Publication number 20190035742
- Publication date Jan 31, 2019
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20180277471
- Publication date Sep 27, 2018
- DAI NIPPON PRINTING CO., LTD.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTION ELEMENT
- Publication number 20180246226
- Publication date Aug 30, 2018
- DAI NIPPON PRINTING CO., LTD.
- Kohei Ota
- G01 - MEASURING TESTING
Information Patent Application
LINE STRUCTURE AND A METHOD FOR PRODUCING THE SAME
- Publication number 20170301627
- Publication date Oct 19, 2017
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20160329273
- Publication date Nov 10, 2016
- DAI NIPPON PRINTING CO., LTD.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINE STRUCTURE AND A METHOD FOR PRODUCING THE SAME
- Publication number 20150235955
- Publication date Aug 20, 2015
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20130328214
- Publication date Dec 12, 2013
- DAI NIPPON PRINTING CO., LTD.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR DEVICE MANUFACTURING METHOD AND SENSOR DEVICE
- Publication number 20130113055
- Publication date May 9, 2013
- DAI NIPPON PRINTING CO., LTD.
- Takamasa TAKANO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20120248553
- Publication date Oct 4, 2012
- DAI NIPPON PRINTING CO., LTD.
- Takamasa TAKANO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120220123
- Publication date Aug 30, 2012
- DAI NIPPON PRINTING CO., LTD.
- Koichi NAKAYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20110056740
- Publication date Mar 10, 2011
- DAI NIPPON PRINTING CO., LTD.
- Takamasa Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100164120
- Publication date Jul 1, 2010
- DAI NIPPON PRINTING CO., LTD.
- Koichi Nakayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Takamasa TAKANO

Person

Patents Grantslast 30 patents

Through electrode substrate and semiconductor device

Through electrode substrate and mounting substrate

Multi-layer line structure and method for manufacturing thereof

Through electrode substrate, method of manufacturing through electr...

Through electrode substrate and semiconductor device

Wiring substrate and semiconductor device

Through electrode substrate, method of manufacturing through electr...

Line structure and a method for producing the same

Through electrode substrate, manufacturing method thereof and mount...

Line structure and a method for producing the same

Through electrode substrate, method of manufacturing through electr...

Through electrode substrate and semiconductor device

Detection element

Through-hole electrode substrate

Line structure and a method for producing the same

Line structure and a method for producing the same

Through-hole electrode substrate

Line structure and a method for producing the same

Sensor device and manufacturing method thereof

Through-hole electrode substrate

Sensor device and manufacturing method thereof

Sensor device manufacturing method and sensor device

Through-hole electrode substrate and method of manufacturing the same

Method of manufacturing a through-hole electrode substrate

Through-hole electrode substrate and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR PACKAG...

MULTI-LAYER LINE STRUCTURE

THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE

THROUGH ELECTRODE SUBSTRATE, METHOD OF MANUFACTURING THROUGH ELECTR...

THROUGH ELECTRODE SUBSTRATE, MANUFACTURING METHOD THEREOF AND MOUNT...

THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE

MULTI-LAYER LINE STRUCTURE AND METHOD FOR MANUFACTURING THEREOF

THROUGH ELECTRODE SUBSTRATE, METHOD OF MANUFACTURING THROUGH ELECTR...

THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

THROUGH ELECTRODE SUBSTRATE, MANUFACTURING METHOD THEREOF AND MOUNT...

LINE STRUCTURE AND A METHOD FOR PRODUCING THE SAME

LINE STRUCTURE AND A METHOD FOR PRODUCING THE SAME

THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE

THROUGH ELECTRODE SUBSTRATE, METHOD OF MANUFACTURING THROUGH ELECTR...

THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE

LINE STRUCTURE AND A METHOD FOR PRODUCING THE SAME

THROUGH-HOLE ELECTRODE SUBSTRATE

DETECTION ELEMENT

LINE STRUCTURE AND A METHOD FOR PRODUCING THE SAME

THROUGH-HOLE ELECTRODE SUBSTRATE

LINE STRUCTURE AND A METHOD FOR PRODUCING THE SAME

THROUGH-HOLE ELECTRODE SUBSTRATE

SENSOR DEVICE MANUFACTURING METHOD AND SENSOR DEVICE

SENSOR DEVICE AND MANUFACTURING METHOD THEREOF

THROUGH-HOLE ELECTRODE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

THROUGH-HOLE ELECTRODE SUBSTRATE AND MANUFACTURING METHOD THEREOF

THROUGH-HOLE ELECTRODE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME