Takami MOTEKI

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Ultrathin copper foil with carrier and printed circuit board using...
- Patent number 7,985,488
- Issue date Jul 26, 2011
- The Furukawa Electric Co., Ltd.
- Yuuji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for high frequency circuit, method of production and ap...
- Patent number 7,985,485
- Issue date Jul 26, 2011
- The Furukawa Electric Co., Ltd.
- Takami Moteki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrathin copper foil with carrier and printed circuit board using...
- Patent number 7,892,655
- Issue date Feb 22, 2011
- The Furukawa Electric Co., Ltd.
- Yuuji Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Ultrathin copper foil with carrier and printed circuit board using...
- Patent number 7,771,841
- Issue date Aug 10, 2010
- Furukawa Electric Co., Ltd.
- Yuuji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND AP...
- Publication number 20110171486
- Publication date Jul 14, 2011
- THE FURUKAWA ELECTRIC CO., LTD.
- Takami MOTEKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ULTRATHIN COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING...
- Publication number 20100270063
- Publication date Oct 28, 2010
- THE FURUKAWA ELECTRIC CO., LTD.
- Yuuji Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND AP...
- Publication number 20090324988
- Publication date Dec 31, 2009
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Takami Moteki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ULTRATHIN COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING...
- Publication number 20070154692
- Publication date Jul 5, 2007
- Furukawa Circuit Foil Co., Ltd.
- Yuuji Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Ultrathin copper foil with carrier and printed circuit board using...
- Publication number 20070141381
- Publication date Jun 21, 2007
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Yuuji Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper foil for high frequency circuit, method of production and ap...
- Publication number 20070042212
- Publication date Feb 22, 2007
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Takami Moteki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper foil for high frequency circuit, method of production and ap...
- Publication number 20050019599
- Publication date Jan 27, 2005
- Takami Moteki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Takami MOTEKI

Person

Patents Grantslast 30 patents

Ultrathin copper foil with carrier and printed circuit board using...

Copper foil for high frequency circuit, method of production and ap...

Ultrathin copper foil with carrier and printed circuit board using...

Ultrathin copper foil with carrier and printed circuit board using...

Patents Applicationslast 30 patents

COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND AP...

ULTRATHIN COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING...

COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND AP...

ULTRATHIN COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING...

Ultrathin copper foil with carrier and printed circuit board using...

Copper foil for high frequency circuit, method of production and ap...

Copper foil for high frequency circuit, method of production and ap...