Takamichi Maeda

Person

Nara, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Solid state imaging device having a solid state image sensor and it...
- Patent number 5,523,608
- Issue date Jun 4, 1996
- Sharp Kabushiki Kaisha
- Kouki Kitaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier semiconductor device
- Patent number 5,506,444
- Issue date Apr 9, 1996
- Sharp Kabushiki Kaisha
- Yasunori Chikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making tape carrier semiconductor device
- Patent number 5,336,650
- Issue date Aug 9, 1994
- Sharp Kabushiki Kaisha
- Yasunori Chikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a bump electrode
- Patent number 5,310,699
- Issue date May 10, 1994
- Sharp Kabushiki Kaisha
- Yasunori Chikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier semiconductor device
- Patent number 5,281,848
- Issue date Jan 25, 1994
- Sharp Kabushiki Kaisha
- Yasunori Chikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of spraying release agent
- Patent number 5,219,608
- Issue date Jun 15, 1993
- Sharp Kabushiki Kaisha
- Kazumasa Aoki
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Tab package and a liquid-crystal panel unit using the same
- Patent number 5,153,705
- Issue date Oct 6, 1992
- Sharp Kabushiki Kaisha
- Kazuhiko Fukuta
- G02 - OPTICS
Information Patent Grant
Wire bonding method
- Patent number 4,993,618
- Issue date Feb 19, 1991
- Sharp Kabushiki Kaisha
- Kenji Toyozawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plastic encapsulant for semiconductor
- Patent number 4,926,239
- Issue date May 15, 1990
- Sharp Kabushiki Kaisha
- Kazuya Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead electrode connection in a semiconductor device
- Patent number 4,536,786
- Issue date Aug 20, 1985
- Sharp Kabushiki Kaisha
- Masao Hayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a through-hole connector
- Patent number 4,383,363
- Issue date May 17, 1983
- Sharp Kabushiki Kaisha
- Masao Hayakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flat shaped semiconductor encapsulation
- Patent number 4,300,153
- Issue date Nov 10, 1981
- Sharp Kabushiki Kaisha
- Masao Hayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-lead frame member with means for limiting mold spread
- Patent number 4,280,132
- Issue date Jul 21, 1981
- Sharp Kabushiki Kaisha
- Masao Hayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic plate for supporting a semiconductor wafer
- Patent number 4,247,590
- Issue date Jan 27, 1981
- Sharp Kabushiki Kaisha
- Masao Hayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead electrode structure for a semiconductor chip carried on a flex...
- Patent number 4,151,543
- Issue date Apr 24, 1979
- Sharp Kabushiki Kaisha
- Masao Hayakawa
- H01 - BASIC ELECTRIC ELEMENTS

Takamichi Maeda

Person

Patents Grantslast 30 patents

Solid state imaging device having a solid state image sensor and it...

Tape carrier semiconductor device

Method of making tape carrier semiconductor device

Method of manufacturing a bump electrode

Tape carrier semiconductor device

Method of spraying release agent

Tab package and a liquid-crystal panel unit using the same

Wire bonding method

Plastic encapsulant for semiconductor

Lead electrode connection in a semiconductor device

Method of making a through-hole connector

Flat shaped semiconductor encapsulation

Multi-lead frame member with means for limiting mold spread

Ceramic plate for supporting a semiconductor wafer

Lead electrode structure for a semiconductor chip carried on a flex...