Takamitsu Noda

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device using mold having res...
- Patent number 9,087,826
- Issue date Jul 21, 2015
- Renesas Electronics Corporation
- Takamitsu Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,053,337
- Issue date Nov 8, 2011
- Renesas Electronics Corporation
- Takamitsu Noda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,888,809
- Issue date Feb 15, 2011
- Renesas Electronics Corporation
- Yuichi Miyagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and manufacturing process for semiconductor device
- Patent number 7,759,223
- Issue date Jul 20, 2010
- NEC Electronics Corporation
- Tsuyoshi Kida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and manufacturing process for semiconductor device
- Patent number 7,554,211
- Issue date Jun 30, 2009
- NEC Electronics Corporation
- Tsuyoshi Kida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method For Manufacturing Semiconductor Device Using Mold Having Res...
- Publication number 20150235937
- Publication date Aug 20, 2015
- RENESAS ELECTRONICS CORPORATION
- Takamitsu Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING MOLD HAVING RES...
- Publication number 20130256851
- Publication date Oct 3, 2013
- RENESAS ELECTRONICS CORPORATION
- Takamitsu Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20100273312
- Publication date Oct 28, 2010
- NEC ELECTRONICS CORPORATION
- Takamitsu Noda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device
- Publication number 20100176517
- Publication date Jul 15, 2010
- NEC Electronics Corporation
- Yuichi Miyagawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20100102461
- Publication date Apr 29, 2010
- NEC ELECTRONICS CORPORATION
- Yuichi Miyagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND MANUFACTURING PROCESS FOR SEMICONDUCTOR DEVICE
- Publication number 20090227088
- Publication date Sep 10, 2009
- NEC ELECTRONICS CORPORATION
- Tsuyoshi Kida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer and manufacturing process for semiconductor device
- Publication number 20050282360
- Publication date Dec 22, 2005
- NEC ELECTRONICS CORPORATION
- Tsuyoshi Kida
- H01 - BASIC ELECTRIC ELEMENTS

Takamitsu Noda

Person

Patents Grantslast 30 patents

Method for manufacturing semiconductor device using mold having res...

Method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor wafer and manufacturing process for semiconductor device

Semiconductor wafer and manufacturing process for semiconductor device

Patents Applicationslast 30 patents

Method For Manufacturing Semiconductor Device Using Mold Having Res...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING MOLD HAVING RES...

Method of manufacturing semiconductor device

Electronic device

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR WAFER AND MANUFACTURING PROCESS FOR SEMICONDUCTOR DEVICE

Semiconductor wafer and manufacturing process for semiconductor device