Takanao Suzuki

Person

Sakura-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a printed wiring board
- Patent number 7,849,591
- Issue date Dec 14, 2010
- Fujikura Ltd.
- Masahiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure sensor package and electronic part
- Patent number 7,549,344
- Issue date Jun 23, 2009
- Fujikura Ltd.
- Satoshi Yamamoto
- G01 - MEASURING TESTING
Information Patent Grant
Method for producing a semiconductor package, with a rerouted elect...
- Patent number 7,157,363
- Issue date Jan 2, 2007
- Fujikura Ltd.
- Takanao Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device and electronic device
- Patent number 7,023,088
- Issue date Apr 4, 2006
- Fujikura Ltd.
- Takanao Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device, electronic device, and...
- Patent number 6,835,595
- Issue date Dec 28, 2004
- Fujikura Ltd.
- Takanao Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device, electronic device and...
- Patent number 6,387,734
- Issue date May 14, 2002
- Fujikura Ltd.
- Masatoshi Inaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor
- Patent number 6,363,791
- Issue date Apr 2, 2002
- Fujitsu Ltd.
- Akihito Kurosaka
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD
- Publication number 20140254120
- Publication date Sep 11, 2014
- FUJIKURA LTD.
- Satoshi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD
- Publication number 20120261177
- Publication date Oct 18, 2012
- FUJIKURA LTD.
- Satoshi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120261179
- Publication date Oct 18, 2012
- FUJIKURA LTD.
- Satoshi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD
- Publication number 20120205148
- Publication date Aug 16, 2012
- FUJIKURA LTD.
- Satoshi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20090154132
- Publication date Jun 18, 2009
- FUJIKURA LTD.
- Masahiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESSURE SENSOR PACKAGE AND ELECTRONIC PART
- Publication number 20080276713
- Publication date Nov 13, 2008
- FUJIKURA LTD.
- Satoshi Yamamoto
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor package, semiconductor device, electronic device, and...
- Publication number 20050037539
- Publication date Feb 17, 2005
- FUJIKURA LTD.
- Takanao Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package, semiconductor device, electronic device, and...
- Publication number 20030207494
- Publication date Nov 6, 2003
- FUJIKURA LTD.
- Takanao Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Takanao Suzuki

Person

Patents Grantslast 30 patents

Method of manufacturing a printed wiring board

Pressure sensor package and electronic part

Method for producing a semiconductor package, with a rerouted elect...

Semiconductor package, semiconductor device and electronic device

Semiconductor package, semiconductor device, electronic device, and...

Semiconductor package, semiconductor device, electronic device and...

Pressure sensor

Patents Applicationslast 30 patents

DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD

DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD

INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRESSURE SENSOR PACKAGE AND ELECTRONIC PART

Semiconductor package, semiconductor device, electronic device, and...

Semiconductor package, semiconductor device, electronic device, and...