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Takanori Kushida
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Yokkaichi, JP
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last 30 patents
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Patent Grant
Epoxy resin sealing material for molding semiconductor chip and met...
Patent number
6,120,716
Issue date
Sep 19, 2000
Matsushita Electric Works, Ltd.
Takanori Kushida
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...