Takanori Okita

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Image pick-up inspection equipment and method
- Patent number 7,627,241
- Issue date Dec 1, 2009
- Renesas Technology Corp.
- Takanori Okita
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20090127315
- Publication date May 21, 2009
- RENESAS TECHNOLOGY CORP.
- Takanori Okita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image pick-up inspection equipment and method
- Publication number 20060170911
- Publication date Aug 3, 2006
- Renesas Technology Corp.
- Takanori Okita
- G01 - MEASURING TESTING
Information Patent Application
Ultrasonic bonding apparatus and method
- Publication number 20050194423
- Publication date Sep 8, 2005
- Renesas Technology Corp.
- Takanori Okita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die bonding apparatus and method of die bonding with the apparatus
- Publication number 20040121513
- Publication date Jun 24, 2004
- Renesas Technology Corp.
- Katsuhiro Taguchi
- H01 - BASIC ELECTRIC ELEMENTS